Ge NCs have attracted considerable attention because of their potential applications in nonvolatile memory and integrated optoelectronics. A number of groups have already proposed integrate flash memories based on Ge NCs embedded SiO 2 matrix [1]. Since Al 2 O 3 presents a high dielectric constant comparatively to SiO 2 , it is a good candidate to replace silica in flash memory systems, and therefore improve their performances [2]. Moreover, Al 2 O 3 presents good mechanical properties, and supports high temperature, which leads it to be an ideal material for Si processing conditions. However, a few studies have been reported on Ge NCs embedded in Al 2 O 3 matrix [3].In this work, Ge NCs embedded in Al 2 O 3 were grown on a commercial RF magnetron Alcatel SCM 650 apparatus using a conventional co-sputtering method. Two materials, Al 2 O 3 (99,99%) and polycrystalline Ge (99,99%), were simultaneously used as target to produce the doped films. Low electrical resistivity (3-6 Ω cm) n-type Si(111) 2 inches wafers were used as substrates. Prior to sputtering, a pressure of at least 1x10 -6 mbar was reached inside the chamber and in situ argon plasma treatment of target and substrates was performed in order to clean the surface and remove any impurities. More details of the samples preparation can be found in pervious works [4,5]. The as grown films were annealed at 800 ºC and 900 ºC, during one hour, under air pressure at 1,0x10 -6 and 1,0x10 -3 mbar, in order to improve the cristallinity of the Ge phase and to achieve control over the NCs size. With the aim to study the cristallinity and distribution of the Ge NCs size Raman spectroscopy, X-ray, and high resolution transmission electron microscopy (HRTEM) techniques were used. X-ray diffraction in conventional θ−2θ geometry (Philips PW1710) was performed towards the crystallographic structure investigation, using Cu K α radiation. The identification of the crystalline phases was made using the JCPDS (Joint Committee of Powder Diffraction) data base. Raman scattering spectra were obtained using a Jobin-Yvon T64000 system with an optical microanalysis system and a CCD detector, in a backscattering geometry. Raman spectroscopy was performed at room temperature using 514.5 nm and 488.0 nm line of an argon laser at a power of 50 μW focus on an area of the sample ~1 μm 2 . After preparing cross-section specimens by standard procedures the structure of the samples was examined using HRTEM.XRD diffraction shows the characteristic peaks of Ge diamond structure, which confirms the high cristallinity of our samples. Figure 1 illustrates the XRD diffraction of an as grown sample and after annealing. It is clear that the post grown annealing treatment leads to sharp peaks and a therefore better cristallinity. The average size of Ge NCs was estimated using the Debye-Scherrer equation [6]. Using Lorentzian functions to fit each XRD peak of the samples, we obtained mean diameter values of 3.0 nm and 5.3 nm for sample B (see table) before and after annealing, respectively. Figure 2 ...