2022
DOI: 10.1016/j.addma.2022.102677
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Structural stability of thin overhanging walls during material extrusion additive manufacturing of thermoset-based ink

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Cited by 10 publications
(9 citation statements)
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“…This is of particular interest when considering the application space of such a structure. To accomplish this feat using conventional DIW manufacturing, the thin‐walled structure would likely need to be printed with support material, [ 32 ] then removed from the original print substrate and repositioned in an inverted configuration, thereby compromising the bond strength between the structure and end‐use surface. Conversely, the proposed unstructured print technique can satisfy this load‐bearing task with an as‐printed, high‐strength structure.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…This is of particular interest when considering the application space of such a structure. To accomplish this feat using conventional DIW manufacturing, the thin‐walled structure would likely need to be printed with support material, [ 32 ] then removed from the original print substrate and repositioned in an inverted configuration, thereby compromising the bond strength between the structure and end‐use surface. Conversely, the proposed unstructured print technique can satisfy this load‐bearing task with an as‐printed, high‐strength structure.…”
Section: Resultsmentioning
confidence: 99%
“…This can be attributed to the sensitivity to gravitational effects on the viscoelastic, shear‐thinning DIW inks requiring the extrusion nozzle to be facing downward during deposition, at the cost of impeding formable geometries. [ 32 ] To overcome this barrier, a rapidly solidifying DIW ink must be utilized. To achieve this, researchers have investigated inks with polymer networks catalyzed via continuous ultraviolet (UV) irradiation.…”
Section: Introductionmentioning
confidence: 99%
“…The SMP-10-Z ink is similar in composition to the ZrB 2 and SMP-10 formulation described in Kemp et al, 5 with the only difference being that, in the present study, the ZrB 2 was not ball milled. FA was selected over a different rheology modifier (like fumed silica) or other commonly used nano-particle materials (like nano-SiC) used in material extrusion AM inks 23,24 for two primary reasons: (1) because pure alumina has a higher melting temperature (2 072 • C) than pure silica (1 710 • C), and (2) the hydrophobized Aeroxide Alu C 805 was found to be an effective rheology modifier for SMP-10 resin compared to other fumed alumina (FA) products that were either hydrophilic or had different surface functionalization. While nano-SiC would be an excellent candidate for the composite after printing and pyrolysis, it is unlikely (though, admittedly, unproven) to impart desirable printing properties to the ink in the same way that a fumed silica or FA would.…”
Section: Materials and Mixingmentioning
confidence: 99%
“…However, these samples were never machined nor tested. At the time of this report, several thermoset material systems have been printed and their rheological and mechanical properties tested through other research projects [29][30][31][32][33][34][35][36].…”
Section: Initial Thermoset Printing Of Test Samplesmentioning
confidence: 99%