Structure and properties correlation of diffusion bonded joint of duplex stainless steel and Ti–6Al–4V with and without Ni–17Cr–9Fe alloy interlayer

Kundu, Sukumar; Thirunavukarasu, Gopinath

doi:10.1007/s40194-016-0327-7

Cited by 16 publications

(3 citation statements)

References 26 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…When titanium and steel are in direct contact, FeTi and Fe 2 Ti compounds are produced. 12,13 These brittle Fe-Ti compounds serve as the source of cracks leading to macroscopic cracks or even delamination, thereby failing the repair process (Figure 2(a)).…”

Section: Resultsmentioning

confidence: 99%

“…Since the WLAR technique showed great potential for repairing damaged structural components, for the repair of titanium-steel bimetallic sheets, how to prevent the interfacial formation of brittle compounds and reduce the strength of bimetallic sheets such as TiFe and TiFe 2 during repair were the common concerns of recent studies. 12,13 The formation of brittle intermetallic compound during direct bonding of these two materials could be minimized by using appropriate intermediate materials. 14 In the context of titanium-steel interconnection, the copper exhibits significant advantages as an intermediary material.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Influence mechanism of copper interlayer on the interface bonding during wire and laser additive repair of TA1/Q235 bimetallic sheets

Zhang,

Xu,

Zhao

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part L:

View full text Add to dashboard Cite

Titanium/steel bimetallic sheets are extensively employed in engineering applications due to their excellent cost performance and high corrosion resistance. However, the interface defect is easy to form due to significant differences in physical and chemical properties between titanium and iron, which need to be improved through effective repair techniques. The wire and laser additive manufacturing (WLAM) method is implemented to repair TA1/Q235 bimetallic sheets. The addition of a copper interlayer plays a crucial role in the repair process. According to the results, S201 copper wire is used as the interlayer material, while TA1 wire serves as the deposit material in the repair process using the WLAM technique. Under the conditions of a laser power setting of 1500 W, a defocusing amount of −40 mm, a deposition speed of 1 mm/s and an argon flow rate of 23 L/min, the interface defects are effectively addressed, leading to successful repair. The WLAMed copper interlayer avoids direct contact between the titanium repaired layer and the steel base layer, improving the interface bonding characteristics. The interior of the repair region of TA1-Q235 bimetallic sheets is made of the pure copper layer, Cu2Ti + Cu4Ti3 layer, CuTi layer, CuTi2+β-Ti layer and pure titanium layer. The copper-titanium compound region exhibits a pronounced increase in hardness, with the repair region achieving a tensile strength of 436 MPa. Notably, the fracture position occurs within the repair region, with the titanium side exhibiting brittle fracture and the steel side displaying ductile fracture.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence mechanism of copper interlayer on the interface bonding during wire and laser additive repair of TA1/Q235 bimetallic sheets

Zhang,

Xu,

Zhao

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part L:

View full text Add to dashboard Cite

show abstract

“…For example, the joint with the Ni interlayer at 1023 K exhibited the highest shear strength of~186 MPa and shear strain of~85 pct (in Figure 9(b)), although the joint interface contained hard intermetallic compounds with hardness >~9 GPa (Figure 8(b)). Interestingly, the direct diffusion-bonded joints exhibited better shear properties, whereas the shear performance of the joints produced with the Cu interlayer (Figure 9 MPa) produced by direct bonding [4,40] and with Cu and Ni interlayers. [2,12,14,25,30,31,41] However, these values are higher than those reported by Elrefaey and Tillmann [27] for CP-Ti/Cu/low carbon steel (50-105 MPa) and by Ö zdemir and Bilgin [42] for Ti64/Cu/SS (20 to 120 MPa).…”

Section: Interface Microstructure Of the Joint Produced With Cu+ni Inmentioning

confidence: 98%

Microstructure and Mechanical Properties of Ti-6Al-4V Alloy/Interstitial Free Steel Joint Diffusion Bonded with Application of Copper and Nickel Interlayers

Raj

Prasad

Narasimhan

2020

Metall Mater Trans A

View full text Add to dashboard Cite

The application of interlayers in solid-state diffusion bonding is considered for facilitating improved joint strength as well as optimizing the bonding parameters. In case of dissimilar metals, the interlayers are preferred to promote diffusivity by reducing the metallurgical incompatibility. In the present work, the effect of formation of intermetallics at interfaces of the dissimilar joints between Ti-6Al-4V (Ti64) alloy and interstitial free (IF) steel, produced by direct diffusion bonding as well as by using the interlayers of copper and nickel, was evaluated. The diffusion bonding experiments were performed in a temperature range of 1023 K to 1223 K, under a constant pressure of 10 MPa for 10 minutes, in high vacuum conditions. It was observed that diffusion of interlayer(s) into the base metals increased with bonding temperature, which led to the increase in intermetallic layers at the joint interface. At 1223 K, the influence of interlayer on microstructure of interfaces was reduced by complete diffusion of interlayers and subsequently led to the interdiffusion of base metals. The maximum shear strength of~186 MPa was recorded for the bonding performed using a nickel interlayer at 1023 K. Detailed microstructure analysis, nanoindentation measurements and shear tests suggest that the presence of a thin layer of hard TiFe intermetallic at the interface has no adverse effect, but a soft remnant interlayer can deteriorate the shear properties of the diffusion-bonded joints.

show abstract

Parametric Optimization of Diffusion Welding Process in Joining of CoCrNi Medium-Entropy Alloys (MEA) and SUS 304 Stainless Steel Using Full Factorial Design

Samiuddin

Muzamil

et al. 2022

JOM

View full text Add to dashboard Cite

Structure and properties correlation of diffusion bonded joint of duplex stainless steel and Ti–6Al–4V with and without Ni–17Cr–9Fe alloy interlayer

Cited by 16 publications

References 26 publications

Influence mechanism of copper interlayer on the interface bonding during wire and laser additive repair of TA1/Q235 bimetallic sheets

Influence mechanism of copper interlayer on the interface bonding during wire and laser additive repair of TA1/Q235 bimetallic sheets

Microstructure and Mechanical Properties of Ti-6Al-4V Alloy/Interstitial Free Steel Joint Diffusion Bonded with Application of Copper and Nickel Interlayers

Parametric Optimization of Diffusion Welding Process in Joining of CoCrNi Medium-Entropy Alloys (MEA) and SUS 304 Stainless Steel Using Full Factorial Design

Contact Info

Product

Resources

About