2022
DOI: 10.2320/matertrans.mt-m2021200
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Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Abstract: The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetall… Show more

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Cited by 11 publications
(3 citation statements)
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“…Gold-based alloys, such as Au-Sn, Au-Sb, and Au-Ge eutectic alloys, are recognized for their exceptional corrosion resistance, high electrical and mechanical strength, and superior thermal conductivity. These attributes render them highly advantageous for electronic packaging applications [4][5][6][7][8]. Au-Ge-based alloys have especially attracted much attention as high-temperature Pb-free solders [4,9].…”
Section: Introductionmentioning
confidence: 99%
“…Gold-based alloys, such as Au-Sn, Au-Sb, and Au-Ge eutectic alloys, are recognized for their exceptional corrosion resistance, high electrical and mechanical strength, and superior thermal conductivity. These attributes render them highly advantageous for electronic packaging applications [4][5][6][7][8]. Au-Ge-based alloys have especially attracted much attention as high-temperature Pb-free solders [4,9].…”
Section: Introductionmentioning
confidence: 99%
“…It means that the structure as presented in figure 1 has the special advantage of the repairable ability. With the repeated increase and decrease in temperature caused by the following processes such as reflowing the flip chip, solidification of the underfill and PSW of the lid, cracks easily form in the Au-20Sn solder due to its brittleness [30]. The Au-20Sn solder will face a higher failure risk when bearing thermal shock during the PSW process.…”
Section: Introductionmentioning
confidence: 99%
“…The Au-Sn-based alloys have been proposed as alternative high-temperature Pb-free solders [4,5]. In particular, the Au-20Sn (wt.%) eutectic alloy is attractive in high-power electronic and optoelectronic devices because of its superior resistance to corrosion and high electrical and thermal conductivity, as well as high mechanical strength [6,7]. To reduce the costs of Au-based solders, alloying elements, such as Ag, Bi, Cu, Ga, Ge, In, Sb, Si, and Zn, may be added to replace part of the Au [8].…”
Section: Introductionmentioning
confidence: 99%