“…To clarify the features of the property formation of the Cu / Mg-composites under investigation, the structural transformations on their interfaces have to be studied in details. The work in this direction has already started [13]. However, it seems that the results obtained in this work in combination with literature data are sufficient to understand the processes that occur in the composites under investigation.…”
The copper-based alloys with high strength and low electrical resistivity are of interest for many practical applications. In this study, Cu / Mg-composites with 1, 7 and 49 magnesium filaments in Cu-matrix have been obtained by hyrdoextrusion at room temperature. The structure, mechanical and electrical properties of the composite rods and thin wires in the deformed and annealed states have been investigated. The strength of the deformed Cu / Mg-composite with a minimal volume fraction of magnesium was found to be abnormally high. The increase of magnesium microhardness was revealed to be near the interface. A change in the lattice constant of the Cu-matrix in the deformed Cu / Mg-composites is discovered by the XRD-method. It has been concluded that, under severe plastic deformation, different solid solutions form on the Cu / Mg-interfaces due to mechanical alloying processes. The Cu / Mg-composite with a maximal volume fraction of Mg has the lowest strength in the deformed state, however, it becomes the strongest one after annealing at 200°C due to annealing hardening of magnesium. The temperature dependences of the electrical resistivity of Cu / Mg-composites differ significantly from each other. During heating, three eutectic transformations are realized in the composite with 7 Mg-filaments. As a result, the electrical resistivity of the deformed Cu / 7Mg-composite increases almost two times. The specific electrical resistivity of the composite with 49 Mg-filaments is a bit different from the electrical resistivity of deformed copper. The mechanisms of structure formation during the heating of these composites have been shown to be significantly different. The obtained results can be used for the development of high-strength Cu-based conductors.
“…To clarify the features of the property formation of the Cu / Mg-composites under investigation, the structural transformations on their interfaces have to be studied in details. The work in this direction has already started [13]. However, it seems that the results obtained in this work in combination with literature data are sufficient to understand the processes that occur in the composites under investigation.…”
The copper-based alloys with high strength and low electrical resistivity are of interest for many practical applications. In this study, Cu / Mg-composites with 1, 7 and 49 magnesium filaments in Cu-matrix have been obtained by hyrdoextrusion at room temperature. The structure, mechanical and electrical properties of the composite rods and thin wires in the deformed and annealed states have been investigated. The strength of the deformed Cu / Mg-composite with a minimal volume fraction of magnesium was found to be abnormally high. The increase of magnesium microhardness was revealed to be near the interface. A change in the lattice constant of the Cu-matrix in the deformed Cu / Mg-composites is discovered by the XRD-method. It has been concluded that, under severe plastic deformation, different solid solutions form on the Cu / Mg-interfaces due to mechanical alloying processes. The Cu / Mg-composite with a maximal volume fraction of Mg has the lowest strength in the deformed state, however, it becomes the strongest one after annealing at 200°C due to annealing hardening of magnesium. The temperature dependences of the electrical resistivity of Cu / Mg-composites differ significantly from each other. During heating, three eutectic transformations are realized in the composite with 7 Mg-filaments. As a result, the electrical resistivity of the deformed Cu / 7Mg-composite increases almost two times. The specific electrical resistivity of the composite with 49 Mg-filaments is a bit different from the electrical resistivity of deformed copper. The mechanisms of structure formation during the heating of these composites have been shown to be significantly different. The obtained results can be used for the development of high-strength Cu-based conductors.
“…While a similar phase fraction of BCC1 and BCC2 was seen in AlCuFeMnTi–Si HEA (Figure 1(b)). In Mg-based HEA, Cu 2 Mg was produced due to the diffusion of Cu/Mg pair with milling time [16]. Figure 1 (a) XRD patterns of AlCuFeMnTi–X (X = Mg, Si, Zn) HEAs milled for 45 h and (b) magnified view of (a) showing BCC1 and BCC2 phases.…”
Section: Resultsmentioning
confidence: 99%
“…While a similar phase fraction of BCC1 and BCC2 was seen in AlCuFeMnTi-Si HEA (Figure 1(b)). In Mg-based HEA, Cu 2 Mg was produced due to the diffusion of Cu/Mg pair with milling time [16].…”
Novel AlCuFeMnTi-X high-entropy alloy (HEA) powder mixture with individual X = Mg, Si, Zn was mechanically alloyed for 45 h and consolidated at 700°C by spark plasma sintering (SPS). The effect of the addition of Mg, Si and Zn was studied on the microstructural evolution, density and microhardness of the developed HEAs. The results demonstrated that milled HEAs were body-centered cubic (BCC) structured (BCC1 and BCC2). The BCC2 fraction was highest in AlCuFeMnTi-Zn followed by AlCuFeMnTi-Si. However, minor Ti, Si and intermetallic compounds (IMC) were observed in AlCuFeMnTi-Mg with BCC1 major phase. After SPS, the alloying improved, and BCC2-rich HEAs were observed for all compositions. An attractive hardness value was obtained in AlCuFeMnTi-Mg due to the dispersed Cu 2 Mg precipitates in the BCC2/BCC1 matrix followed by AlCuFeMnTi-Si and AlCuFeMnTi-Zn HEA, respectively.
“…1a). The formation of Cu 2 Mg was noticed which can be due to the interdiffusion of Cu/Mg pair to form an intermetallic compound (IMC) Cu 2 Mg with milling time [24]. It appears that Cu 2 Mg phase hardly decreases and remains in the matrix even after 45 or 60 h of milling.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…It is reported that after heating of the Cu/Mg diffusion pair above 200 °С, initially, the first phase forms is CuMg 2 phase. However, when the temperature exceeds 400 °С, the presence of copper atoms surrounding Mg gives rise to Cu 2 Mg [24].…”
Section: Phase Evolution Of Powder and Bulk Lwheamentioning
In this study, we synthesized a new Al 16.6 Cu 16.6 Fe 16.6 Mn 16.6 Mg 16.6 Ti 16.6 lightweight high entropy alloy (LWHEA) by high energy ball milling and spark plasma sintering (SPS). The effect of milling time (15, 30, 45, and 60 h) and SPS conditions (600 and 700 °C) on microstructure, hardness, and density of LWHEAs were studied. The results showed that milled LWHEA is base centered cubic (BCC) structured, consisting of dual BCC1/BCC2 matrix with dispersed minor Cu 2 Mg precipitates and Ti. After SPS of milled samples, the BCC2 phase fraction was increased gradually. The distribution of Ti was uniform up to 45 h milled sample SPSed at 600 °C. However, porosity was built up beyond 45 h milling and higher SPS temperature (700 °C). The presence of finer secondary phases in the HEA matrix contributes to the dispersion hardening. The optimum microhardness and density of LWHEA AlCuFeMnMgTi were around 770 HV and 4.34 g cm − 3 which is superior to other conventional alloys such as Al or Ti-based alloys.
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