Structure and properties of rodlike poly(p-phenylene pyromellitimide)s containing short side groups

Kim, S.I; Shin, Tae Joo; Pyo, S. M.; Moon, Jongun; Ree, Moonhor

doi:10.1016/s0032-3861(98)00375-9

Cited by 34 publications

(38 citation statements)

References 18 publications

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“…8,89,90,[132][133][134] Such high property performances are achievable from fully rodlike poly(p-phenylene pyromellitimide) (PMDA-PDA PI) and poly(4,4'-biphenylene pyromellitimide) (PMDA-BZ PI), so that they are so attractive to both industry and academia. However, they are very brittle and further their dielectric constants are not low enough, so that they are practically useless.…”

Section: Pi Dielectricsmentioning

confidence: 99%

“…Thus, there still is a big challenge to improve their brittleness and dielectric constant with retaining the high moduli. Attempts to improve such drawbacks with a little sacrifice of the high modulus have been made in two different ways: (i) incorporation of short side groups into the polymer backbone [89][90][91][92][93][94][95][96][97][98][99] and (ii) insertion of proper linkages into the polymer backbone. 6 There are two options in incorporating short side groups into the polymer rod.…”

Section: Pi Dielectricsmentioning

confidence: 99%

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High performance polyimides for applications in microelectronics and flat panel displays

2006

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Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical resistance properties due to their heterocyclic imide rings and aromatic rings on the backbone. Due to these advantageous properties, PIs have found diverse applications in industry. Most PIs are insoluble because of the nature of the high chemical resistance. Thus, they are generally used as a soluble precursor polymer, which forms complexes with solvent molecules, and then finally converts to the corresponding polyimides via imidization reaction. This complexation with solvent has caused severe difficulty in the characterization of the precursor polymers. However, significant progress has recently been made on the detailed characterization of PI precursors and their imidization reaction. On the other hand, much research effort has been exerted to reduce the dielectric constant of PIs, as demanded in the microelectronics industry, through chemical modifications, as well as to develop high performance, light-emitting PIs and liquid crystal (LC) alignment layer PIs with both rubbing and rubbing-free processibility, which are desired in the flat-panel display industry. This article reviews this recent research progresses in characterizing PIs and their precursors and in developing low dielectric constant, light-emitting, and LC alignment layer PIs.

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Section: Pi Dielectricsmentioning

confidence: 99%

Section: Pi Dielectricsmentioning

confidence: 99%

High performance polyimides for applications in microelectronics and flat panel displays

2006

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“…Additionally, polybenzoxazoles have been attained from ortho-methoxy aromatic polyamides in some instances, mainly looking for a substantial thermal resistance increment of the precursor polyamides [27]. Other authors have followed this approach to prepare PBOs with various purposes [28,29].…”

Section: Introductionmentioning

confidence: 99%

Gas separation membranes made through thermal rearrangement of ortho-methoxypolyimides

et al. 2015

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SummaryOrtho-methoxypolyimides were prepared by the classical chemical imidization method and also by azeotropic imidization, using 3,3'-dimethoxybenzidine (DMAB) and hexafluoroisopropylidene diphthalic anhydride (6FDA) as monomers. High molecular weights were achieved by both methods, and the physical properties of the materials were investigated by spectroscopic and thermal analytical techniques. Polymers exhibited excellent thermal properties and film-forming ability, which allowed them to be tested as dense membranes for gas separation after a convenient treatment at high temperature (450 °C) to promote thermal rearrangement (TR). Spectroscopic evidences indicated that the final composition of the TR materials seemed not to correspond to TR-polibenzoxazoles, as it is the case when ortho-hydroxypolyimides are exposed to similar thermal treatments. A detailed study was carried out with the purpose of elucidating the actual mechanism of rearrangement, comparing ortho-

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“…[26] By assuming that such a relationship holds for the coPIs studied here, a structure-property relationship for coPIs could be explained as follows: due to the unsymmetric and bulky structure of DAn, the DAnrich polymer chains should be prevented from packing closely, and this causes an increase in the free volume which results in the decrease of n AV . Since the dielectric constant e is related to the refractive index n by the equation e = n 2 , [12,26] the above result indicates that an incorporation of DAn into the polyimide would be advantageous in order to lower the dielectric constant.…”

Section: Properties Of Polyimidesmentioning

confidence: 95%

A study on the effect of spirocyclic structures in the main chain on the physical properties of copolyimides

Kudo

Shiraishi³

2000

Macromol. Rapid Commun.

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Structure and properties of rodlike poly(p-phenylene pyromellitimide)s containing short side groups

Cited by 34 publications

References 18 publications

High performance polyimides for applications in microelectronics and flat panel displays

High performance polyimides for applications in microelectronics and flat panel displays

Gas separation membranes made through thermal rearrangement of ortho-methoxypolyimides

A study on the effect of spirocyclic structures in the main chain on the physical properties of copolyimides

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