Structure and property modulation of primary CoSn and peritectic CoSn2 intermetallic compounds through ultrasonicating liquid Sn–10%Co alloy

Peritectic Intermetallic Compound (IMC) Morphology of Transient Liquid Phase Solder - A Short Review

“…Interestingly, the compilation of all those three types peritectic phases morphology were observed in Sn-Co alloys, reported by J.M. Liu et al [9]. Sn-Co based alloy is one of the promising candidates for lead free solder alloys [10].…”

Morphologies of intermetallic compound phases in Sn-Cu and Sn-Co peritectic alloys during directional solidification

“…1, the Sn-32at.% Cu alloy experiences the solidification of the primary Cu 3 Sn phase at 530 ºC [23,26,27] : L→Cu 3 Sn, then the peritectic reaction at T P =415 ºC: L+Cu 3 Sn→Cu 6 Sn 5 , and the eutectic reaction at T E =231.96 ºC. The Sn-9at.% Co alloy experiences the solidification of the primary CoSn phase at 810 ºC: L→CoSn, the peritectic reaction at T P =525 ºC [31][32][33] : L+CoSn→CoSn 2 , and eutectic reaction at T E =231.96 ºC. The microstructures of the directionally solidified Sn-32at.% Cu peritectic alloys before deep etching are given in Fig.…”

“…Investigation on the Sn-Cu solders of high Sn content is of great interest since the operating temperature of solders can be enhanced by increasing the content of Cu. Sn-Co alloys are also widely used in lead-free solders, negative electrode materials, etc [30][31][32][33][34][35] . In Sn-based solders used in electronic packaging, Co can form a good diffusion barrier between solder and substrate due to its low solubility [36][37][38] .…”

Microstructural Evolution and Solute Migration in the Mushy Zone of Peritectic Al-18 At. Pct Ni Alloy in High Magnetic Fields

“…Recent studies have demonstrated that the external field could significantly affect the solidification behavior of a peritectic alloy. [25,26] However, compared with the eutectic alloy, limited research can be found on the peritectic alloy.…”