2016
DOI: 10.1016/j.intermet.2016.05.012
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Structure and thermoelectric performance of β-Cu2Se doped with Fe, Ni, Mn, In, Zn or Sm

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Cited by 64 publications
(46 citation statements)
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“…Finally, the overall thermal conductivity decreased, and the overall figure of merit could be further improved as shown in Figure 5. The peak values for the figure of merit appear to be 1.2 at 823 K for the samples sintered at 1173 K for 2 h. Although the zT values obtained are slightly smaller than those reported work using SPS [5,[25][26][27], hot press [28], water quenching/liquid nitrogen quenching [7] methods, the fabrication method employed in this work is very simple and has a low cost.…”
Section: Thermoelectric Performancementioning
confidence: 56%
“…Finally, the overall thermal conductivity decreased, and the overall figure of merit could be further improved as shown in Figure 5. The peak values for the figure of merit appear to be 1.2 at 823 K for the samples sintered at 1173 K for 2 h. Although the zT values obtained are slightly smaller than those reported work using SPS [5,[25][26][27], hot press [28], water quenching/liquid nitrogen quenching [7] methods, the fabrication method employed in this work is very simple and has a low cost.…”
Section: Thermoelectric Performancementioning
confidence: 56%
“…Element‐doping and composition off‐stoichiometry are the two general and effective approaches to tune carrier concentrations. However, most of the elements have very low doping limit in liquid‐like materials,11f,24 thus the effect of element‐doping on carrier concentrations regulation is usually not very obvious. In contrast, the latter approach, i.e., composition off‐stoichiometry, is proved to be effective in tuning carrier concentrations in a wide range, especially for those liquid‐like materials with a large range of intrinsic lattice defects.…”
Section: Strategies For Improving Te Performance Beyond Plec Conceptmentioning
confidence: 99%
“…The solid symbols represent data of nominally stoichiometric Cu 2 M samples 7,8b,g,h,k,m,n,28. The hollow symbols represent data of Cu deficient Cu 2−δ M samples 8j,24. The half‐up solid symbols represent data of solid solutions 8l,o,26–29.…”
Section: Strategies For Improving Te Performance Beyond Plec Conceptmentioning
confidence: 99%
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