2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and 2014
DOI: 10.1109/eurosime.2014.6813809
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Structure design and reliability assessment of double-sided with double-chip stacking packaging

Yu-Chung Su
1
,
Cheng‐Hsiung Lin
2
,
Tzu-Ying Kuo
3
et al.
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