By carefully controlling the surface chemistry of the chemical vapor deposition process for silicon carbide (SiC), 100 lm thick epitaxial layers with excellent morphology were grown on 4 off-axis SiC substrates at growth rates exceeding 100 lm/h. In order to reduce the formation of step bunching and structural defects, mainly triangular defects, the effect of varying parameters such as growth temperature, C/Si ratio, Cl/Si ratio, Si/H 2 ratio, and in situ pre-growth surface etching time are studied. It was found that an in-situ pre growth etch at growth temperature and pressure using 0.6% HCl in hydrogen for 12 min reduced the structural defects by etching preferentially on surface damages of the substrate surface. By then applying a slightly lower growth temperature of 1575 C, a C/Si ratio of 0.8, and a Cl/Si ratio of 5, 100 lm thick, step-bunch free epitaxial layer with a minimum triangular defect density and excellent morphology could be grown, thus enabling SiC power device structures to be grown on 4 off axis SiC substrates. V C 2013 AIP Publishing LLC.