Stub TLM modelling of heat flow in semiconductor devices

Cogan, Donard de; Shah, Ankur K.

doi:10.1088/0022-3727/19/5/006

Cited by 12 publications

(6 citation statements)

References 1 publication

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“…In cases where there are significant computational overheads due to discontinuities within the transmission line network, significant reductions can be obtained by means of open circuit stublines [12]. The matching of linklines by means of impedance transformation provides an alternative approach.…”

Section: Methods Of Lmoedance Matchinnmentioning

confidence: 99%

Impedance Transformations and Mesh Coarsening in TLM Heat Flow Modeling

Cogan

Enders

Gui

1992

UNHB

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Numerical models of muWmafed systems are open constmined by stiffness faclon, which impede numerical efficiency. Thus, heal flow simuhlions in problem involving widely differen1 thermal time constants can require excessively fine meshes, extremely small &ration time steps, or bolh. The tmnsmisswn line rmulir method is an unconditionally sfable technique thnt uses a network of impedances and resistances lo model thermal dffusion. This paper outlines a method by which these pammeten can be tmnsfonned as a means of improving computational efficiency while maintaining compatibility wilh microscopic models.

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Section: Methods Of Lmoedance Matchinnmentioning

confidence: 99%

Impedance Transformations and Mesh Coarsening in TLM Heat Flow Modeling

Cogan

Enders

Gui

1992

UNHB

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“…Note that the current (analogous to mass flow or heat flux) and voltage (analogous to particle density or temperature) are conserved in a different fashion at the time the scattering event takes place, as expressed by Equations (5) and (7), respectively. The product of current and voltage is also conserved, implying a conservation of power.…”

Section: Validity Of Using Shunt Resistors Instead Of Series Resistormentioning

confidence: 99%

Use of lossless transmission‐line segments and shunt resistors for TLM diffusion modelling

Gui¹

2003

Int J Numerical Modelling

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SUMMARYIn diffusion modelling by means of the transmission-line matrix (TLM) method, a nodal arrangement of using lossless transmission-line segments and series resistors is almost exclusively adopted and is currently considered as a standard approach. In this paper, the use of shunt resistors instead of series resistors is shown to represent an equally valid configuration. As a starting point, we have derived the telegrapher's equation in its most general form for TLM modelling of diffusion processes. A general algorithm based on the shunt-resistor TLM model for implementing a numerical solution of the diffusion equation in multiple dimensions is given. Fundamental analysis and calculated examples confirm that the alternative shuntresistor configuration does not exhibit the unwanted absorption effects suggested by a recent paper (Internat. J. Numerical Model.: Electronic Networks, Devices and Fields 2002; 15:261).

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“…A pulse entering a stub from a node at the start of a time-step returns to the node at the end of the time-step (i.e., storage during one iteration). , [ is the stub impedance] so that the matrix for the center is (10) If we have a lossy stub (i.e., a half-length open-circuit stub) in series with a resistor then this effectively shunts the signal so that . We could also have a link-resistor node [ Fig.…”

Section: B Propagation Analysis 1) Network and Scattering Matricesmentioning

confidence: 99%

Propagation analysis for thermal modeling

Cogan

1998

IEEE Trans. Comp., Packag., Manufact. Technol. A

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Propagation analysis was originally developed as a tool for the analysis of the transmission line matrix (TLM) numerical technique and its relationship to other numerical methods for heat-flow. It provides a useful alternative to the conventional frequency-domain methods for analyzing parabolic differential equations. This paper outlines the details of the technique and demonstrates the manner in which it provides information about attenuation and phase in what is essentially lossy wave propagation.

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Stub TLM modelling of heat flow in semiconductor devices

Cited by 12 publications

References 1 publication

Impedance Transformations and Mesh Coarsening in TLM Heat Flow Modeling

Impedance Transformations and Mesh Coarsening in TLM Heat Flow Modeling

Use of lossless transmission‐line segments and shunt resistors for TLM diffusion modelling

Propagation analysis for thermal modeling

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