2016
DOI: 10.1007/s10853-016-9883-x
|View full text |Cite
|
Sign up to set email alerts
|

Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
2
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(2 citation statements)
references
References 34 publications
0
2
0
Order By: Relevance
“…Such effect has been described previously for co-plating of Sn-Bi. 21,22 The microstructure in Fig. 3e, however, showed a large numbers of pinholes, and the edges of the films showed non-uniform plating, although the number of dendrites observed was minimal.…”
Section: Resultsmentioning
confidence: 95%
See 1 more Smart Citation
“…Such effect has been described previously for co-plating of Sn-Bi. 21,22 The microstructure in Fig. 3e, however, showed a large numbers of pinholes, and the edges of the films showed non-uniform plating, although the number of dendrites observed was minimal.…”
Section: Resultsmentioning
confidence: 95%
“…20 Gelatin, a widely used leveler and grain refiner in metal electroplating processes, has been in use in the industry for several decades. 11 Although there have been studies on the individual effects on these two additives on Sn-Bi alloys, 21,22 very few efforts have been made to identify their combined effects on the electroplating of tin. Furthermore, the dominant mechanisms controlling the nucleation and growth processes during tin electrodeposition in the presence of these two additives are yet to be identified.…”
mentioning
confidence: 99%