“…These resins are being used in coatings, adhesives, hardware components, semiconductor encapsulation, and electronic circuit board materials due to their high performance properties such as tensile strength, high stiffness, exceptional electrical strength, and excellent chemical resistance, etc. [1][2][3] But, epoxy resins are brittle in nature with poor strength and toughness. 4,5 In order to overcome this problem, we need to incorporate modifiers (like polymer based nano-fillers) into the epoxy resin to ensure a remarkable enhancement in the mechanical and thermal properties of epoxy resins.…”