2005
DOI: 10.1016/j.msea.2005.01.039
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Studies on the effect of delayed aging on the mechanical behaviour of AA 6061 SiCp composite

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Cited by 14 publications
(6 citation statements)
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“…(2004) reported aging temperature is a major factor for controlling precipitate type, volume fraction and size. Aging time (AGTm) ; aging time is also a control factor of precipitate size distribution (Cai et al. , 2014, Mahadevan et al. , 2005; Siddiqui et al.…”
Section: Materials and Experimental Proceduresmentioning
confidence: 99%
See 1 more Smart Citation
“…(2004) reported aging temperature is a major factor for controlling precipitate type, volume fraction and size. Aging time (AGTm) ; aging time is also a control factor of precipitate size distribution (Cai et al. , 2014, Mahadevan et al. , 2005; Siddiqui et al.…”
Section: Materials and Experimental Proceduresmentioning
confidence: 99%
“…Aging time (AGTm) ; aging time is also a control factor of precipitate size distribution (Cai et al. , 2014, Mahadevan et al. , 2005; Siddiqui et al.…”
Section: Materials and Experimental Proceduresmentioning
confidence: 99%
“…Aluminum composites are used in different applications few of them are Pistons, brake plate and cylinder and so on [1]. Aluminum composite increases the particulate reinforcement increases the strength by following traditional methods [2,3]. SiC is most normal molecule utilized in aluminum alloy composites [4,5] for light weight applications by addition of clay particles in the matrix the strength of the composite increases [6] Al6061 combination is warm treatable and subsequently additionally increment in quality can be normal [7], heat treatment process improves the strength and fit to design the material for industries [8].…”
Section: Introductionmentioning
confidence: 99%
“…Although they possess desirable mechanical properties, fiber reinforcement composites exhibit anisotropic behavior and are not easily produced by conventional techniques. Whereas MMCs reinforced with particles offer modest enhancement of properties they are more isotropic and can be processed by conventional routes [9,10]. AlSiC have thermal conductivities (170-200W/MK) that are compatible with maximum thermal energy dissipation for IC devices [11][12][13].…”
Section: Introductionmentioning
confidence: 99%