2009
DOI: 10.1016/j.solmat.2008.12.005
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Studies on the structural properties of SiO:H films prepared from (SiH4+CO2+He) plasma in RF-PECVD

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Cited by 42 publications
(23 citation statements)
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“…Cooling of SiO is accompanied by its disproportionation to Si and SiO 2 . [18][19][20] An example of a typical fabrication method via a thermal route is heating a mixture of Si and SiO 2 at 1400 C to obtain gaseous SiO and subsequently condensing at 600 C. 20 The kinetic process of the disproportionation is dominated by many parameters among others the rate of quenching, including the distance from the heat source and the substrate or the collecting vessel, and hence, difficult to bring under precision control.…”
Section: Introductionmentioning
confidence: 99%
“…Cooling of SiO is accompanied by its disproportionation to Si and SiO 2 . [18][19][20] An example of a typical fabrication method via a thermal route is heating a mixture of Si and SiO 2 at 1400 C to obtain gaseous SiO and subsequently condensing at 600 C. 20 The kinetic process of the disproportionation is dominated by many parameters among others the rate of quenching, including the distance from the heat source and the substrate or the collecting vessel, and hence, difficult to bring under precision control.…”
Section: Introductionmentioning
confidence: 99%
“…When using CO 2 as oxygen source there is no carbon incorporation in the layers because the CO 2 is dissociated into oxygen and carbon monoxide which is a very inert gas and pumped away. An incorporation of carbon from CO 2 has also not been reported by other groups .…”
Section: Methodsmentioning
confidence: 59%
“…The high‐intensity band around 1020 cm −1 corresponds to the stretching mode of the Si–O–Si configuration in which Si atoms are backbonded to other oxygen atoms . This band shows no dependence on the ASL thickness.…”
Section: Resultsmentioning
confidence: 99%