“…With the aggressive scaling down in technology nodes, advanced microelectronic devices utilize new materials and processing methods, of which, the full comprehension on material reactions and reliability can be difficult to accomplish. Most recently, Penzes and co-workers [8] reported new observations of induced damages on 28 nm test structures via a 1340 nm continuous wave laser (commonly used in optical failure analysis). This raises concerns to the suitability of employing 1064 nm pulsed laser tests in the field of test, qualification and failure analysis as the technique itself may generate undesired artifacts.…”