Study of a pre-treatment process for electroless copper plating on ceramics

Ma, Hongfang; Liu, Zhibao; Wu, Lei; Wang, Yihan; Wang, Xixia

doi:10.1016/j.tsf.2011.05.005

Cited by 38 publications

(20 citation statements)

References 13 publications

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“…XRD analysis also revealed that the average crystallite size of Al 2 O 3 increased from 8.84 to 26.19 nm which confirms the deposition of Cu crystallites with an increase in the mean thickness of ca 17.35 nm. A similar XRD pattern has also been reported in the literature, where the strongest peak of electroless‐deposited Cu appeared at 2 θ = 43°.…”

Section: Resultssupporting

confidence: 87%

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Design and fabrication of electro‐conductive polymer nanocomposites with mechanical and thermal resistance

Batool

Nadeem

Gill

et al. 2018

Polymer International

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The commencement of the industrial revolution paved the way for the fabrication of flexible polymers with high-strength metalloceramics as novel materials of all kinds. Fabricating metal-ceramic/polymer conductive composites is one such dimension followed for the present research work making use of the properties of the three components. Electroless deposition, for permanent metallic coating, was performed to coat Al 2 O 3 with metallic Cu followed by the inclusion of the Cu-Al 2 O 3 filler into a poly(vinyl chloride) (PVC) matrix. X-ray diffraction and energy-dispersive X-ray studies predicted a prominent growth of metallic Cu crystallites onto Al 2 O 3 with an increased average size and variation in elemental composition, respectively, when compared to pristine Al 2 O 3 . Morphological behaviour via scanning electron microscopy also envisioned uniform Cu coating onto Al 2 O 3 and a homogeneous dispersion throughout the polymer matrix. When incorporated into PVC, electrical conductivity analysis highlighted a distinct variation in composite phases from insulating (7.14 × 10 −16 S cm −1 ) to semiconducting behaviour (8.33 × 10 −5 S cm −1 ) as a function of Cu-Al 2 O 3 filler. Mechanical behaviour (tensile strength, Young's modulus and elongation at break) and thermal properties of the prepared composites also indicated a substantial improvement in material strength with Cu-Al 2 O 3 incorporation. The enhanced electrical conductivity along with improved thermomechanical status with significant filler-matrix interaction permits the potential usage of such novel composites in a range of state-of-the-art semiconducting electronic devices.

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Section: Resultssupporting

confidence: 87%

“…Some nodular structures can also be observed in the SEM micrograph of the coated version (Fig. (b)) similar to that described in the literature …”

Section: Resultssupporting

confidence: 84%

Design and fabrication of electro‐conductive polymer nanocomposites with mechanical and thermal resistance

Batool

Nadeem

Gill

et al. 2018

Polymer International

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“…17 20 Liang et al showed that ELCu films can be deposited onto AlN substrates using tin-sensitization and palladium-activation processes. 21 For copper electroless deposition onto a ceramic substrate, a precoating or pre-adsorption of a layer of catalyst, such as AuNPs 19 or Pd adtoms, 21,22 is necessary. However, the adsorbed catalyst does not strongly bond to the ceramic surface.…”

mentioning

confidence: 99%

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Shen

Dow

2014

J. Electrochem. Soc.

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AlN substrates have been extensively used for heat dissipation, especially in high-power light-emitting diodes (LEDs). However, the AlN substrate is an electric insulator and thus needs to be metalized to serve as an electric circuit carrier and heat conductor for LED packaging. Herein, we propose a wet process that can be performed at room temperature to metallize AlN substrates. The wet metallization process involves copper electroless deposition and copper electroplating. The catalyst used for the copper electroless deposition was PdCl 2 , which was chemically grafted onto the AlN surface. The chemical grafting agent was 3-(2-aminoethylamino)propyltrimethoxysilane (APTMS). Before the chemical grafting step, an etching step in KOH solution was critical for good adhesion of the plated copper layer. The electroless copper depositions were catalyzed using chemically grafted Pd and a commercial Sn/Pd colloid. An adhesion comparison test of the plated copper layers was performed to demonstrate that the copper adhesion performance obtained with the chemically grafted Pd process was substantially better than that obtained with the commercial Sn/Pd colloid process.

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“…Crystallite size of plated Cu was calculated by applying the Scherrer's equation, expressed in eq. as follows:

D = \frac{K λ}{β c o s θ}

…”

Section: Resultsmentioning

confidence: 99%

“…The conducting polymer composite was fabricated by dispersing the conducting filler in the polymer solution. The calculated amount of Cu-Al 2 O 3 filler (i.e., 3,6,9,12,15,18, or 21 wt %) was suspended in the 30 mL THF. The corresponding amount of polymer, i.e., PS-b-PMMA or PS was then added to the mixture and was allowed to stirrer for 6 hours.…”

Section: Fabrication Of Conductive Composite Filmsmentioning

confidence: 99%

Fabrication of alumina based electrically conductive polymer composites

Nadeem

Rizwan

Gill

et al. 2015

J of Applied Polymer Sci

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Novel electrically conductive composites were synthesized by incorporating Cu coated alumina (Cu‐Al2O3) powder prepared via electroless plating technique as filler (0–21wt %) into polystyrene‐b‐methylmethacrylate (PS‐b‐PMMA) and polystyrene (PS) matrices. XRD analysis depicted maximum Cu crystallite growth (26.116 nm∼ plating time 30 min) onto Al2O3 along with a significant change in XRD patterns of composites with Cu‐Al2O3 inclusion. SEM–EDX analyses exhibited uniform Cu growth onto Al2O3 and confirmed presence of Cu, Al, Pd in Cu‐Al2O3, and C, O, Al, Cu, and Pd in PS‐b‐PMMA and PS composites. Increasing filler loadings exhibited increased electrical conductivity (5.55 × 10−5S/cm for PS‐b‐PMMA; 5.0 × 10−6S/cm for PS) with increased Young's modulus (1122MPa for PS‐b‐PMMA; 1053.9MPa for PS) and tensile strength (27.998MPa for PS‐b‐PMMA; 30.585MPa for PS) and decreased % elongation. TGA demonstrated increased thermal stability and DTG revealed two‐step degradation in composites while DSC depicted pronounced increment in Tg of Cu‐Al2O3/PS‐b‐PMMA with increased filler loading. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 42939.

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Study of a pre-treatment process for electroless copper plating on ceramics

Cited by 38 publications

References 13 publications

Design and fabrication of electro‐conductive polymer nanocomposites with mechanical and thermal resistance

Design and fabrication of electro‐conductive polymer nanocomposites with mechanical and thermal resistance

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Fabrication of alumina based electrically conductive polymer composites

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