A low-thermal-budget n-type polycrystalline Ge (poly-Ge) channel that was prepared by plasma in-situ-doped nanocrystalline Ge (nc-Ge) and visible pulsed laser annealing exhibits a high electrically active concentration of 2 × 1019 cm−3 and a narrow Raman FWHM of 3.9 cm−1. Furthermore, the fabricated n-type poly-Ge junctionless FinFET (JL-FinFET) shows an Ion/Ioff ratio of 6 × 104, Vth of −0.3 V, and a subthreshold swing of 237 mV/dec at Vd of 1 V and DIBL of 101 mV/V. The poly-Ge JL-FinFET with a high-aspect-ratio fin channel is less sensitive to Vth roll-off and subthreshold-swing degradation as the gate length is scaled down to 50 nm. This low-thermal-budget JL-FinFET can be integrated into three-dimensional sequential-layer integration and flexible electronics.