2000
DOI: 10.1016/s0257-8972(99)00646-5
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Study of anodic oxidation of aluminum in mixed acid using a pulsed current

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Cited by 63 publications
(29 citation statements)
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“…One reason for this could be the embrittlement of the coatings due to the incorporation of additional elements from the electrolyte. Shih et al [10] proposed that the enhanced hardness of anodic oxide coatings obtained from a sulphuric acid electrolyte after nitric acid addition results from a higher sulfur content within the oxide. Another explanation could be the influence of nitric acid and oxalic acid on the conversion behavior of the iron-rich intermetallic phases.…”
Section: Discussionmentioning
confidence: 99%
“…One reason for this could be the embrittlement of the coatings due to the incorporation of additional elements from the electrolyte. Shih et al [10] proposed that the enhanced hardness of anodic oxide coatings obtained from a sulphuric acid electrolyte after nitric acid addition results from a higher sulfur content within the oxide. Another explanation could be the influence of nitric acid and oxalic acid on the conversion behavior of the iron-rich intermetallic phases.…”
Section: Discussionmentioning
confidence: 99%
“…1(g)), the electrode is passive from open circuit potential to 3.0 V SCE . During the polarization of Al at positive potentials, gas is evolved from the Al electrode surface, and no passive region is observed in the various concentrations of HClO 4 solutions, as in the Al/HCl system [22], except in 12 M HClO 4 solution. The gas was collected carefully in a small beaker during the polarization of the Al electrode in 1.0 M perchloric acidic solutions.…”
Section: Methodsmentioning
confidence: 99%
“…Instead Cr, Ti, Al and Mg have been observed to passivize copper surfaces [2,3]. Al-containing copper alloys have high corrosion resistance, and they have been widely used in several fields ranging from microelectronics to aerospace [29][30][31]6]. The results of refractory metal nitration of Cu thin films deposited on Si 2 O show that a protective layer can be formed by annealing either a Cu-(27 at.% Ti) or a Cu-(26 at.% Cr) alloys.…”
Section: Introductionmentioning
confidence: 99%