Study of cutting quality for TFT-LCD glass substrate

Pan, Chunxu; Hsieh, Chia‐Hsu; Su, Chun‐Hsi; Liu, Z. S.

doi:10.1007/s00170-007-1293-4

Cited by 30 publications

(9 citation statements)

References 16 publications

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“…It also produced median cracks, radial cracks and lateral cracks, leading to an uneven severing surface in break-severing. It was identical to the results in the scribing-and-breaking severing of ceramics and silica glass substrates [ 1 , 3 ]. In contrast, no breakages happened on the severing workpiece edges along the micro-ground microgroove-apex in micro-crack-induced severing (see Figure 6 b).…”

Section: Resultssupporting

confidence: 84%

“…As a result, the micro-grinding was able to fabricate an accurate and smooth microgroove without any cracks around its apex. In contrast, the scribing produced the cracks along the scratch [ 2 , 3 ].…”

Section: Resultsmentioning

confidence: 99%

“…In order to improve the life of tool micro-tips, a chemical vapor deposition (CVD) diamond roller was developed for scribing instead of PCD and carbide alloy rollers [ 1 ]. Lateral and radial cracks were, however, produced on severing surfaces due to the mechanical force of mechanical wheel rolling [ 2 , 3 ]. Generally, a follow-on smooth profile grinding and polishing were needed along with inefficiency and pollution.…”

Section: Introductionmentioning

confidence: 99%

“…It has been known that the median crack depth decreased with decreasing loading force, but it still reached about 90 μm with the load of 22 N in scribing alumina ceramics [ 1 ]. In scribing LCD glass, it reached about 45 μm with the load of 5.5 N [ 2 ] and about 90 μm with the cutting pressure of 0.16 MPa [ 3 ], respectively. Until now, the scribing of harder quartz glass chips has not yet been reported.…”

Section: Introductionmentioning

confidence: 99%

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Study on Micro-Crack Induced Precision Severing of Quartz Glass Chips

2018

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It is difficult to cut hard and brittle quartz glass chips. Hence, a method involving micro-crack-induced severing along a non-crack microgroove-apex by controlling the loading rate is proposed. The objective is to realize the rapid and precision severing of the hardest quartz glass in chip materials. Firstly, micro-grinding was employed to machine smooth microgrooves of 398–565 μm in depth; then the severing force was modelled by the microgroove shape and size; finally, the severing performance of a 4-mm thick substrate was investigated experimentally. It is shown that the crack propagation occurred at the same time from the microgroove-apex and the loading point during 0.5 ms in micro-crack-induced severing. The severing efficiency is dominated by the severing time rather than the crack propagation time. When the loading rate is less than 20–60 mm/min, the dynamic severing is transferred to static severing. With increasing microgroove-apex radius, the severing force decreases to the critical severing force of about 160–180 N in the static severing, but it increases to the critical severing force in the dynamic severing. The static severing force and time are about two times and about nine times larger than the dynamic ones, respectively, but the static severing form error of 16.3 μm/mm and surface roughness of 19.7 nm are less. It is confirmed that the ideal static severing forces are identical to the experimental results. As a result, the static severing is controllable for the accurate and smooth separation of quartz glass chips in 4 s and less.

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Section: Resultssupporting

confidence: 84%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Study on Micro-Crack Induced Precision Severing of Quartz Glass Chips

2018

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“…유리는 이산화규소 (SiO 2 )를 주성분으로 갖는 비결 정질 고체로서 재질의 우수한 광학적 특성으로 인해 전 통적으로 광학, 통신 및 디스플레이 기기의 중요 소재 로 사용되고 있다. 여러 응용분야에 유리가 적절히 사용되기 위해서는 유리를 다양한 형상으로 정밀하게 가공하는 것이 필요 하나, 물리적 접촉을 이용하는 기계적 가공 방법 1,2) 으 로는 취성이 높은 유리소재를 정밀하게 가공하데 어려 움이 있다. 높은 밀도의 광 에너지를 열원으로 사용하 는 비 접촉 방식의 레이저 공정 3,4) 은 취성이 높은 재료 가공 시 발생하는 균열 및 재료 손실을 최소화 시킬 수 있는 장점이 있어 레이저를 이용한 다양한 유리 가공 기술이 개발 및 연구되고 있다 [5][6][7] .…”

Section: 서 론unclassified

CO2 Laser Drilling Processing of the Cover Glass using the Taguchi Method

신¹,

최²

2019

Journal of Welding and Joining

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This study reports CO 2 laser drilling of the cover glass using the Taguchi method. In this study, the Taguchi method containing L16 (4 factors and 4 levels) orthogonal array design was employed to investigate the effect of process parameters on hole quality. Based on the results of experiments, holes with a high total hole quality index (THQI) show less cracking and heat affected zone (HAZ), and in this case the circular morphology of a hole is relatively well kept. From the Taguchi analysis, it is found that the THQI is significantly affected by laser power, however the effect of the focal position on the THQI is very small. The optimal process parameters to maximize the THQI are the laser power of 20 W, the scan speed of 20 mm/s, the scan of 1 pass and the focal position of 0 mm. The regression model to predict the THQI is obtained using the surface response method. It is confirmed that the regression model predicts the THQI with 5.717 % error (average).

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Implementation of cross-generation automation transportation system in the TFT-LCD industry

Chang

Lai

2014

Int J Adv Manuf Technol

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Study of cutting quality for TFT-LCD glass substrate

Cited by 30 publications

References 16 publications

Study on Micro-Crack Induced Precision Severing of Quartz Glass Chips

Study on Micro-Crack Induced Precision Severing of Quartz Glass Chips

CO2 Laser Drilling Processing of the Cover Glass using the Taguchi Method

Implementation of cross-generation automation transportation system in the TFT-LCD industry

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