2003
DOI: 10.1016/s0924-0136(03)00718-0
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Study of electrical discharge machining technology for slicing silicon ingots

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Cited by 57 publications
(18 citation statements)
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“…For silicon, slicing efficiency is also proportional to the average current. The cutting speed reaches about 600 mm 2 /min, which is the highest in former research (Luo et al, 1992;Okada et al, 1998;Peng and Liao, 2003). But the result of cutting 210Cr12 is not the same (Fig.…”
Section: Slicing Efficiencymentioning
confidence: 81%
“…For silicon, slicing efficiency is also proportional to the average current. The cutting speed reaches about 600 mm 2 /min, which is the highest in former research (Luo et al, 1992;Okada et al, 1998;Peng and Liao, 2003). But the result of cutting 210Cr12 is not the same (Fig.…”
Section: Slicing Efficiencymentioning
confidence: 81%
“…However, to the best of our knowledge, few investigations of these special techniques in machining the TiNi SMAs have been reported [21]. WEDM has been acquiring wide acceptance for the machining of various conductive materials used in real applications such as metals, ceramics, silicon and metal matrix composites [22][23][24][25][26]. It is a numerically controlled, modified electro-discharge technique where the workpiece geometry is generated by a NC-controlled travelling wire.…”
Section: Introductionmentioning
confidence: 99%
“…By applying this hybrid system, the process applicability was enhanced and assembled component setting and inspection problems were reduced. 48,92,93 Pusan National University and KIMM co-worked to develop chemical mechanical micro-machining process. 49 The system use chemical solution which reacts on the substrate and restricts the plastic deformation.…”
Section: Additive/assistivementioning
confidence: 99%