“…The sample was then delayered from the front side to remove the epoxy molding compound, the passivation layer, metallization layers and the control gate (CG, poly 2), so that the inter-poly oxide layer above the floating gate (FG, poly 1) was exposed (figure 1(a)). The delayering was achieved with techniques typical for failure analysis, including reactive ion etching, chemical etching and polishing, the details of which can be referred to our previous work [14].…”