Study of Ground-Signal-Ground TSV in terms of transmission performance

Abstract

With the development of the integrated circuits, the electronic devices become smaller and smaller, higher density within, and more and more function. The through silicon via (TSV) is the core to the three-dimensional integrated circuit. This paper focuses on the effect to the transmission characteristic of the Ground-Signal-Ground (GSG) TSV. Effects of design parameters, co-simulation with CPW, equivalent circuit model are studies. In a word, good agreement is achieved on transmission parameters between the 3D electromagnetic solver and the proposed lumped circuit model.