2015 38th International Spring Seminar on Electronics Technology (ISSE) 2015
DOI: 10.1109/isse.2015.7247972
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Study of high power COB LED modules with respect to topology of chips

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Cited by 8 publications
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“…This package design enables higher power intensity [15]. As LED chips are very closely spaced, designers must first optimize the distance between them to ensure an ideal balance of their thermal and optical properties [16,17]. A LED array can be formed with two different methods.…”
Section: Introductionmentioning
confidence: 99%
“…This package design enables higher power intensity [15]. As LED chips are very closely spaced, designers must first optimize the distance between them to ensure an ideal balance of their thermal and optical properties [16,17]. A LED array can be formed with two different methods.…”
Section: Introductionmentioning
confidence: 99%