2019
DOI: 10.1016/j.ceramint.2018.11.165
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Study of material removal mechanisms in grinding of C/SiC composites via single-abrasive scratch tests

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Cited by 72 publications
(18 citation statements)
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“…Grinding has been the main means for machining precision C/C-SiC composite material parts [24][25][26][27]. Compared with other machining methods, grinding has the advantages of high machining precision and high machining efficiency.…”
Section: Smentioning
confidence: 99%
“…Grinding has been the main means for machining precision C/C-SiC composite material parts [24][25][26][27]. Compared with other machining methods, grinding has the advantages of high machining precision and high machining efficiency.…”
Section: Smentioning
confidence: 99%
“…Fibers scratched in the ⊥ and || directions are often removed as blocks by peeling or pushing away [74]. Li et al [75] reached a similar conclusion in the single grain scratch test and considered that the cutting force and direction would affect the failure mode and subsurface influence zone of the material. Garcia Luna et al [25] studied the effects of grain shape, size, spacing, and fiber direction on the material removal mechanism of SiC/SiC composite grinding through a single grain scratch test (Fig.…”
Section: Materials Removal Mechanismmentioning
confidence: 94%
“…Different cutting methods have various effects on chip width, and the order of chip width is ⊥ > || > ⊙. Fibers scratched in the ⊥ and || directions are often removed as blocks by peeling or pushing away [74]. Li et al [75] reached a similar conclusion in the single grain scratch test and considered that the cutting force and direction would affect the failure mode and subsurface influence zone of the material.…”
Section: Materials Removal Mechanismmentioning
confidence: 99%
“…Large shear angle θmax will produce more shearing load on carbon fibers rather than pulling load during scratching (Li et al (2019)), which is conducive to obtaining intact fibers with minimal cracks on the scratching grooves, as shown in Fig. 11b,d,f,h, it can be calculated from Eq.…”
Section: Reciprocating Scratching Morphologymentioning
confidence: 99%
“…Zheng et al (2018) worked on UAS testing of SiCp/Al, and showed that the higher material removal rate and better surface integrity can be achieved in scratching with ultrasonic vibration. Li et al (2019) studied the influence of conventional scratching parameters on the fiber fracture of C/SiC in transverse and longitudinal scratching directions, and found that the fiber breakage and fiber/matrix interfacial debonding exhibit predominant damage behaviors. Two-dimensional UAS tests were carried out to study the material removal mechanisms in elliptical ultrasonic grinding.…”
Section: Introductionmentioning
confidence: 99%