Three cross-sections (rectangular, bullet-like and triangular), resulting from fabrication process, of nanoscale In0.53Ga0.47As-on-insulator FinFETs with a gate length of 10.4 nm are modelled using in-house 3D finite-element densitygradient quantum-corrected drift-diffusion and Monte Carlo simulations. We investigate the impact of the shape on I-V characteristics and on the variability induced by Metal Grain Granularity (MGG), Line-Edge Roughness (LER) and Random Dopants (RDs) and compared to their combined effect. The more triangular the cross-section, the lower the off-current, the draininduced-barrier-lowering and the sub-threshold slope. The ION / IOF F ratio is 3 times higher for the triangular-shaped FinFET than for the rectangular-shape one. Independently of the crosssection, the MGG variations are the pre-eminent fluctuations affecting the FinFETs, with 4-to-2 times larger σVT than that from the LER and the RDs, respectively. However, the variability induced threshold voltage (VT) shift is minimal for the MGG (around 2.0 mV), but VT shift increases 4-fold and 15-fold for the LER and the RDs, respectively. The cross-section shape has a very small influence in VT and off-current of the MGG, LER and RD variabilities, both separated and in combination, with standard deviation differences of only 4% among the different device shapes. Finally, the statistical sum of the three sources of variability can predict simulated combined variability with only a minor overestimation.