Study of microstructural evolution during operation of electrically connected components and analysis of failure mechanism

Abstract

As a key current-carrying structure of high-voltage bushings, the reliability of electrical connection components is crucial to the safe and stable operation of power equipment. To obtain the microstructural evolution of electrical connection components with different deterioration states, CUD strap contactors were deteriorated in different ways, and electron backscatter diffraction (EBSD) technique was used to test the microstructure of strap contactors with different deterioration states. The results showed that compared to the unused contactors, the contact resistance of the contactors under the combined effect of friction and high temperature increased 203.12 times and was in a failed state. During the process from unused state to wear deterioration, high temperature deterioration, and then to eventual failure of the contactors, the average grain size gradually grows from 8.15 μm to 25 μm, the dislocation density gradually decreases from 2.38×1014 m-2 to 1.04×1014 m-2, and there are a significant proportion of the recrystallized organization. These changes are detrimental to the mechanical properties of the contactors. In addition, the distribution of grain boundaries in the contact area proves the occurrence of over-temperature phenomenon in this area, which will accelerate the deterioration of the contactors and eventually lead to the failure of the component. The relevant conclusions can provide a theoretical basis for the design of electrical connection structure of strap contacts as well as the study of deterioration mechanism.