Study of Negative Charge Accumulation Mechanism and Removal Method on the Wafer Surface in Via Photo Development Process

Understanding the impact of rinse on SEM image distortion and hole patterning variability

“…Very recently, Chen et al reported the influence of the wafer surface charging effect on the precision of measuring ADI features during photo development process using CD-SEM [14]. They made the same observation than the previous authors: that deionized water used in via photo development process would induce negative charge accumulation on the wafer surface.…”