Study of Polybenzoxazole Precursors for Low Temperature Curing

Iwashita, K.; Hattori, Takashi; Minegishi, Tomonori; Ando, Shinji; Toyokawa, Fumihiro; Ueda, Mitsuru

doi:10.2494/photopolymer.19.281

Cited by 11 publications

(6 citation statements)

References 4 publications

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“…The absence of a carbonyl functional group in the PBO polymer prevents the formation of a hydrogen bond between the polymer and water, therefore resulting in less water absorption in the film. Additionally, PBO material is known for its excellent thermal stability and thermo-oxidative resistance, and can be used in and is compatible with various front-end and back-end assembly applications [11], [21]- [25], [27]. The material is also easily processed and with a photosensitizer will act as a photoresist or hardmask during etching, as has been shown with other photosensitive polymer materials [4], [9], [28], [29].…”

Section: Introductionmentioning

confidence: 92%

See 1 more Smart Citation

Variable Frequency Microwave and Convection Furnace Curing of Polybenzoxazole Buffer Layer for GaAs HBT Technology

Yota

Ramanathan

et al. 2007

IEEE Trans. Semicond. Manufact.

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Photosensitive polybenzoxazole (PBO) film has been used in GaAs heterojunction bipolar transistor (HBT) technology for stress buffer and mechanical protection layer applications. However, this film needs to be cured at high temperatures for a long period of time in order to obtain its desired excellent material characteristics. High-temperature curing can result in degradation to the electrical characteristics and performance of the underlying GaAs devices due to limited thermal budget. In this paper, we have characterized the effects of curing the PBO film on GaAs HBT wafers using a conventional convection furnace and using a variable frequency microwave (VFM) furnace. The results show that a VFM cure can achieve similar excellent physical, mechanical, thermal, and chemical material characteristics at a lower curing temperature and in a much shorter time, as compared to convection furnace curing, therefore resulting in minimal GaAs device degradation. Based on these results, an optimum curing condition using the VFM method can be obtained that satisfies both stress buffer layer material and device requirements for GaAs HBT technology.

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Section: Introductionmentioning

confidence: 92%

“…PBO is a group of materials that is preferred and has become the polymer of choice for many thin-film applications recently [11], [21]- [25]. It has the advantage over other polymer films due to its functional group that does not have the polar carbonyl group C O , unlike polyimide films [11], [12], [26], [27].…”

Section: Introductionmentioning

confidence: 99%

Variable Frequency Microwave and Convection Furnace Curing of Polybenzoxazole Buffer Layer for GaAs HBT Technology

Yota

Ramanathan

et al. 2007

IEEE Trans. Semicond. Manufact.

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“…If the structure constituting PBO is made flexible, low temperature curing is possible [51], and a thermoacid generator that generates sulfonic acid by heat is added. It has been reported that it cyclizes at low temperatures [52]. Furthermore, Kusunoki reported photosensitive polynorbornene which has low modulus, low dielectric constant, low water absorption with low temperature curable [53].…”

Section: Low Temperature Curable Photosensitive Polyimidementioning

confidence: 99%

Polyimides for Micro-electronics Applications

Tomikawa¹

2022

Polyimides

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Polyimide is an organic polymer that exhibits the highest level of heat resistance, exhibits excellent mechanical properties and electrical insulation, and is stable for a long period of time. In addition, since it is easy to obtain polymers with different physical characteristics by changing the combination of monomers, it is possible to obtain the desired properties according to the application, and it is used in a wide range of fields such as insulating protective films for semiconductors and electronic components. This chapter describes polyimides used in microelectronics applications such as semiconductors, electronic components, displays, image sensors, and lithium-ion secondary batteries. The development of practical aspects such as photosensitivity, low-temperature curability, and adhesion to copper when used in microelectronics will be described.

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“…Thermally stable and photosensitive polymers, especially photosensitive polyimides (PSPIs) (18)(19)(20)(21)(22) and polybenzoxazoles (PSPBOs) (27)(28)(29)(30)(31)(32), are widely used as protection and insulation layers of very-large-scale integrationcircuit multichip modules for computers. Even though PSPIs and PSPBOs have greatly enhanced the progress of microelectronics so far, more technological innovations involving simpler processes and more valuable properties such as transparency, low dielectric constant, higher sensitivity, low temperature cyclization, etc.…”

Section: The Concept Of Chemical Amplification Was Proposed By Ito Wmentioning

confidence: 99%