1999
DOI: 10.1016/s0921-5107(99)00092-6
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Study of silicon-doped VGF-GaAs by DSL-etching and LVM spectroscopy and the influence of B2O3 coating

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Cited by 13 publications
(4 citation statements)
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“…[9], is parallel to a /1 1 0S-direction within the (0 0 1)-plane. This dislocation type was reported by some authors for VGF [9,10] and other growth methods [6,[11][12] .…”
Section: Introductionsupporting
confidence: 76%
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“…[9], is parallel to a /1 1 0S-direction within the (0 0 1)-plane. This dislocation type was reported by some authors for VGF [9,10] and other growth methods [6,[11][12] .…”
Section: Introductionsupporting
confidence: 76%
“…For low EPD Si-doped GaAs, a cross-like arrangement of etch pits along the crystallographic directions [1 0 0] and [0 1 0] on (0 0 1)-oriented wafers is very common [9,10]. In some cases, this cross extends over the full diameter of the wafer.…”
Section: Introductionmentioning
confidence: 99%
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“…Due to the exchange reaction 2B 2 O 3 þ 3Si # 3SiO 2 þ 4B, silicon added to the melt will be partly incorporated into boron oxide, whereas boron pollutes the melt [158]. Due to the exchange reaction 2B 2 O 3 þ 3Si # 3SiO 2 þ 4B, silicon added to the melt will be partly incorporated into boron oxide, whereas boron pollutes the melt [158].…”
Section: Doping and Segregationmentioning
confidence: 99%