1990
DOI: 10.1002/sia.740151207
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Study of surface passivation of InP

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Cited by 11 publications
(6 citation statements)
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“…The first corresponds to a binding energy of 443.4 eV, while the second is located at 444.4 eV ( Figure 6). Comparison to literature data [39] and considering the weight loss detected in the DTA/TG measurements leads to the assignment of the signal at 444.4 eV to an oxidized In species. This leaves the signal at 443.4 eV for the intermetallic indium in InPd 2 , corresponding to a shift to lower binding energy of around 0.4 eV compared to elemental indium 443.84 eV.…”
Section: In Situ Stabilitymentioning
confidence: 78%
“…The first corresponds to a binding energy of 443.4 eV, while the second is located at 444.4 eV ( Figure 6). Comparison to literature data [39] and considering the weight loss detected in the DTA/TG measurements leads to the assignment of the signal at 444.4 eV to an oxidized In species. This leaves the signal at 443.4 eV for the intermetallic indium in InPd 2 , corresponding to a shift to lower binding energy of around 0.4 eV compared to elemental indium 443.84 eV.…”
Section: In Situ Stabilitymentioning
confidence: 78%
“…[4][5][6]. In the case of Yb-doped InP, there is a lack of reports concerning XPS investigations (see Ref.…”
Section: Introductionmentioning
confidence: 99%
“…shown in Figure 4F and also in Figure 6A no deep precipitates could be seen in optimized p+n (Cd,S) structures. On the contrary, as shown in Figure 6B in the case of p+n (Zn,S) structures, a large density of Zn,P,-rich deep precipitates could be found even when phosphorus-rich diffusion caps were used [12]. These precipitates (most probably Zn,P& could be easily identified even by EDAX, and might explain why the highest surface hole concentration of our p' n (Zn,S) structures appears to be limited to 1.5 x 10" cm-,.…”
Section: Deep Precipitates and Dislocationsmentioning
confidence: 79%
“…Using higher resolution etching solutions such as HN0,;HBr (1:3) [2], which produce sharp pits on both n-or p-InP, accurate defect revealing of up to 5 x lo6 EP/cm2 is possible [4]. However, due to a relatively large overall etch rate it is not possible to perform EPD revealing inside one given layer of a thin multilayer structure or at the interfaces.…”
Section: O L T a G Ementioning
confidence: 98%
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