Study of the curing kinetics of melamine/phthalonitrile resin system

Lv, Juan; Hong, Jinlang; Liang, Bo; Zhao, Erjin; Zeng, Ke; Chen, Menghao; Hu, Jianghuai; Ye, Gang

doi:10.1016/j.tca.2019.178442

Cited by 20 publications

(12 citation statements)

References 36 publications

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“…The activation energy observed from Figure for α = 0.05 – 0.95 displays a few differences, and the average E α, C of PFDP/10APPH systems is 65.87 kJ mol −1 . It is worth mentioning that the value of average apparent activation energy is less than those of previous reports about PN (87 – 105 kJ mol −1 ), [ 50 ] which suggested that the energy barrier needed for curing PFDP/10APPH is lower. Additionally, the E α, C of the PFDP/10APPH system shows a slightly downward trend, which may be due to the increase of the cross‐linking density with the conversion, and thus the decrease of free volume.…”

Section: Resultsmentioning

confidence: 56%

Fluorinated Phthalonitrile Resin with Excellent Thermal Stability and Low Dielectric Constant for High‐Frequency Electronic Packaging

Hao

et al. 2021

Macro Materials & Eng

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Phthalonitrile (PN) resin promising material for preparing high‐speed and high‐frequency electronic packaging because of its unique hightemperature resistance and excellent insulation performance. A fluorinated PN oligomer (4,4’‐bis (p‐perfluoro‐phenol‐(bis(p‐phenol)perflouoropropane‐2,2‐diyl)‐p‐oxy‐diphthalonitrile) (PFDP)) containing trifluoromethyl and decafluorobiphenyl groups are designed, synthesized, and characterized. The oligomer is blended with 4‐(aminophenoxy) phthalonitrile (APPH), and then cured into polymers under the temperature‐programmed process. The reactive blend has good processability, and structures of isoindole, triazine ring, and phthalocyanine ring are found in the curing reactions. The fluorinated PN (P‐380) shows outstanding thermal stability and mechanical properties (5% thermal degradation temperature: 518 °C (N2); 516 (Air), THeat‐resistance index: 268 °C, activation energy of thermal decomposition: 334.89 kJ mol−1, glass transition temperature (Tg) > 400 °C). Meanwhile, the fluorinated PN simultaneously exhibited a superior low dielectric constant (Dk, 2.21) and dielectric loss (Df, 0.01) at 10 GHz. Moreover, the water absorption of the resin is as low as 0.74%, which meets the requirement of dielectric materials. These results would strongly suggest such PFDP PN resin as excellent packaging materials in those high‐tech applications such as aerospace and communication electronic devices.

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Section: Resultsmentioning

confidence: 56%

Fluorinated Phthalonitrile Resin with Excellent Thermal Stability and Low Dielectric Constant for High‐Frequency Electronic Packaging

Hao

et al. 2021

Macro Materials & Eng

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“…In this case, regardless of the analyzed heating rate, all values obtained are higher than 0 (values listed in Table 4 ). Due to the values obtained between 0.04 and 0.1 and the geometry of the curves, an autocatalytic reaction model with a high proportion of the autocatalytic process is suggested [ 63 , 64 ]. To fulfil this premise, one of the conditions is that value of α M is between 0 and α p (condition clearly fulfilled) and that the maximum of the z ( α ) function obtained at different heating rates, denoted as

is higher than α M .…”

Section: Resultsmentioning

confidence: 99%

Kinetic Analysis of the Curing Process of Biobased Epoxy Resin from Epoxidized Linseed Oil by Dynamic Differential Scanning Calorimetry

et al. 2021

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The curing process of epoxy resin based on epoxidized linseed oil (ELO) is studied using dynamic differential scanning calorimetry (DSC) in order to determine the kinetic triplet (Ea, and A) at different heating rates. The apparent activation energy, Ea, has been calculated by several differential and integral isoconversional methods, namely Kissinger, Friedman, Flynn–Wall–Ozawa (FWO), Kissinger–Akahira–Sunose (KAS) and Starink. All methods provide similar values of Ea (between 66 and 69 kJ/mol), and this shows independence versus the heating rate used. The epoxy resins crosslinking is characterized by a multi-step process. However, for the sake of the simplicity and to facilitate the understanding of the influence of the oxirane location on the curing kinetic, this can be assimilated to a single-step process. The reaction model has a high proportion of autocatalytic process, fulfilling that aM is between 0 and ap and aM < . Using as reference the model proposed by Šesták–Berggren, by obtaining two parameters (n and m) it is possible to obtain, on the one hand, the kinetic parameters and, on the other hand, a graphical comparison of the degree of conversion, α, versus temperature (T) at different heating rates with the average n and m values of this model. The good accuracy of the proposed model with regard to the actual values obtained by DSC gives consistency to the obtained parameters, thus suggesting the crosslinking of the ELO-based epoxy has apparent activation energies similar to other petroleum-derived epoxy resins.

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“…To cure the PN resins, aromatic amines 21–23 with high thermal stability, such as bis[4‐(4‐aminophenoxy)phenyl]‐sulfone ( p ‐BAPS) or bis[4‐(3‐aminophenoxy)phenyl]‐sulfone ( m ‐BAPS), ~2–5 wt%, have traditionally been added to the PN monomer to initiate curing and this polymerization reaction usually occurred at temperatures as low as 175°C. However, long cure times at elevated temperatures are usually needed to achieve a degree of cure necessary to maintain good mechanical properties over a wide range of temperatures 6 .…”

Section: Introductionmentioning

confidence: 99%

“…More recently, a number of researchers have developed hybrid and modified PN-based resins with several unique functionalities aimed at improving the processing as well as the mechanical and thermal performance. [16][17][18][19][20] To cure the PN resins, aromatic amines [21][22][23] with high thermal stability, such as bis [4-(4-aminophenoxy)phenyl]sulfone (p-BAPS) or bis [4-(3-aminophenoxy)phenyl]sulfone (m-BAPS), $2-5 wt%, have traditionally been added to the PN monomer to initiate curing and this polymerization reaction usually occurred at temperatures as low as 175 C. However, long cure times at elevated temperatures are usually needed to achieve a degree of cure necessary to maintain good mechanical properties over a wide range of temperatures. 6 Although not a limiting factor for many applications, lowering the cure time would be advantageous from an energy consumption perspective and for emerging applications needing rapid cure times.…”

Section: Introductionmentioning

confidence: 99%

Improved cure kinetics of phthalonitrile resins using dicyanamide‐based ionic liquids

Wolfgang

Dysart

Laskoski

2022

J of Applied Polymer Sci

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Phthalonitrile (PN) polymers are high-temperature thermosetting resins with excellent thermal and mechanical performance, but they exhibit notably long cure-times hindering their use in certain applications. Ionic liquids (ILs) and aromatic amines provide an opportunity to cure at lower temperatures and shorter times. Dicyanamide-based ILs are an interesting class of hightemperature organic salts due to their high thermal stability and -CN functionality. The addition of ionic liquid in concentrations of 10 and 20 wt% enabled a decrease of the crossover modulus by 30 and 45 C, respectively. When the samples were mixed with both 3 wt% of an amine curing additive and the ionic liquid, the temperature of the crossover modulus was decreased even more dramatically with cure temperatures up to 96 C below that of the PN resin without additives. The differential scanning calorimetry results support the rheological findings that the ILs decrease the temperature and/or time required to cure PN resins. Herein, a dicyanamide-based ionic liquid catalyzed the curing of PN resins by lowering the gelation temperature by up to 40 C, decreased the processing viscosity by five-to eight-fold, and increased the density of the resin thermosets by nearly 3% on average.

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Study of the curing kinetics of melamine/phthalonitrile resin system

Cited by 20 publications

References 36 publications

Fluorinated Phthalonitrile Resin with Excellent Thermal Stability and Low Dielectric Constant for High‐Frequency Electronic Packaging

Fluorinated Phthalonitrile Resin with Excellent Thermal Stability and Low Dielectric Constant for High‐Frequency Electronic Packaging

Kinetic Analysis of the Curing Process of Biobased Epoxy Resin from Epoxidized Linseed Oil by Dynamic Differential Scanning Calorimetry

Improved cure kinetics of phthalonitrile resins using dicyanamide‐based ionic liquids

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