Study of the electrophoretic deposition copper–carbon nanotubes composite coatings in deep eutectic solvent using a Taguchi experimental design approach

Pech-Rodríguez, W. J.; Rocha–Rangel, Enrique; Calles-Arriaga, Carlos Adrián; Vargas‐Gutiérrez, G.; Rodríguez-Varela, F.J.

doi:10.1080/17436753.2018.1495896

Cited by 9 publications

(2 citation statements)

References 32 publications

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“…Jeyarag et al 38 carried out investigations on the effect of process parameters of electrodeposited Ni-Al2O3 composite coating, and also 39 studied electrodeposited Ni-Cr composite coating using a Taguchi L27 orthogonal array approach and mathematical modelling, using robust design approach. Pech-Rodríguez et al 40 studied the electrophoretic deposition of copper-carbon nanotubes composite coatings in deep eutectic solvent using a Taguchi experimental design approach. The optimisation of microhardness of electrodeposited Co-Ag coatings using Taguchi design and ANOVA methods was carried out by Kirati et al 41…”

Section: Taguchi Methodsmentioning

confidence: 99%

Statistical approaches in surface finishing. Part 3. Design-of-experiments

Smith¹,

Larson

2019

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This paper is the third and final part of a short series of articles aimed towards describing some of the various statistical methods and approaches that have been used in surface finishing. Here, various types of Design-of-Experiments (DOE) techniques are described, such as full and fractional factorial design, central composite design, response surface methodology and Taguchi methods. Their application in the design of surface finishing related experiments are then reviewed, ending with a worked example of a two-level 2 4 full factorial DOE.

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Section: Taguchi Methodsmentioning

confidence: 99%

Statistical approaches in surface finishing. Part 3. Design-of-experiments

Smith¹,

Larson

2019

Transactions of the IMF

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“…Although a variety of approaches have been adopted, previous studies have primarily focused on enabling the dispersion of CNTs in general CuSO 4 aqueous solutions and rarely consider the possibility of using non-aqueous baths that allow the homogeneous dispersion of hydrophobic CNTs without any treatment or dispersants. Pech-Rodríguez et al reported the possibility of using a eutectic solvent as a plating bath for Cu/CNT composite platings; however, because eutectic solvents are ionic, they required prior functionalization of the CNTs [39].…”

Section: Introductionmentioning

confidence: 99%

Preliminary Study on Electrodeposition of Copper Platings and Codeposition of Carbon Nanotubes from Organic Solvent

et al. 2023

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Metal/carbon composite plating is an effective strategy for improving and adding properties to metal plating by incorporating carbon materials into the metal matrices. Copper (Cu) is widely applied, particularly in the areas of heat management and electronic packaging owing to its high thermal and electrical conductivities, which can be further improved together with improvements in mechanical properties by compositing it with carbon nanotubes (CNTs). However, because hydrophobic CNTs are hardly dispersible in aqueous solutions, additional intense acid treatment or the addition of dispersants is required for their dispersion. Moreover, previous studies have reported that these methods suffer from deterioration of composite material performance through the destruction of the CNT surface or the inclusion of dispersants into the plating. Therefore, in this study, the electrodeposition of a Cu/CNT composite in a non-aqueous solvent that can disperse CNTs without any additional treatment is investigated. The experimental results show that it is possible to deposit Cu from a N-methyl-2-pyrrolidone containing copper iodide and potassium iodide. Furthermore, Cu/CNT composite platings containing CNTs up to 0.12 mass% were prepared by constant current electrolysis, and applying pulse electrolysis can increase the CNTs content up to 0.22 mass%.

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