Study of the processing chemistry of polyimides with thermogravimetry/Fourier transform infrared/mass spectrometry techniques

Xie, Wei; Heltsley, Rebecca; Li, Hanxu; Lee, Charles; Pan, Wei‐Ping

doi:10.1002/app.10190

Cited by 7 publications

(3 citation statements)

References 2 publications

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“…500, 530 and 560 • C for PI-a, PI-b and PI-c, respectively. The continuous weight loss in the initial stage may be attributed to the evaporation of the preabsorbed water and solvent from the films [9]. It was also found that the temperature of thermal weight loss increased with the increasing of thermal imidization temperature of PAA.…”

Section: Atomic Force Microscopy (Afm)mentioning

confidence: 91%

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Synthesis and characterization of polyimide thin films obtained by thermal evaporation and solid state reaction

Al-Ajaj

Kareem

2016

Materials Science-Poland

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In this research polyimide films were prepared by physical vapor deposition (PVD), using solid state reaction of pyromellitic dianhydride (PMDA) and p-phenylene diamine (PDA) to form poly(amic acid) (PAA) films. The resultant films were converted to polyimide by thermal treatment, usually below 300 • C. For this study, a FT-IR spectrometer has been used to measure the effect of imidization temperature on the chemical structure of the vapor-deposited thin films of aromatic PI. When temperature increased, an increase in all absorption peaks was observed. This suggests that residual PAA monomers continued to be converted into PI. The surface topology of the PI films obtained at imidization temperatures of 150, 200, 250 • C for 1 hour was further examined by using AFM atomic force microscopy. It can be clearly seen that the surface became rougher with increasing imidization temperature. The thermal stability of polyimide was also studied by using thermogravimetric analysis (TGA).

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Section: Atomic Force Microscopy (Afm)mentioning

confidence: 91%

“…The absorption peaks at 1790 cm −1 and 1730 cm −1 indicate that there is asymmetry and symmetric stretching vibration of C=O bonding. The absorption peak at 710 cm −1 corresponds to the flexural vibration of C=O bonds [8,9].…”

Section: Ft-ir Analysismentioning

confidence: 99%

Synthesis and characterization of polyimide thin films obtained by thermal evaporation and solid state reaction

Al-Ajaj

Kareem

2016

Materials Science-Poland

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“…52 In the PI-OMe, in the rst weight loss region, along with the peak associated with CO 2 , a change in intensity was observed for species having a molecular weight of 15, which could be associated with the loss of methyl groups resulting from the methoxy group breakage. 53,54 Thermal treatment of precursor polyimides Supplementary TGA analyses were performed to adjust the thermal treatment settings for TR sample preparation in the tubular furnace. To do this, the PI lms treated at 300 C were further heated to the desired temperature (350 C, 400 C and 450 C) using a heating rate of 5 C min À1 , and then held isothermally at the target temperature for 3 h.…”

Section: Thermal Properties Of Precursor Polyimidesmentioning

confidence: 99%

Gas separation membranes made through thermal rearrangement of ortho-methoxypolyimides

et al. 2015

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SummaryOrtho-methoxypolyimides were prepared by the classical chemical imidization method and also by azeotropic imidization, using 3,3'-dimethoxybenzidine (DMAB) and hexafluoroisopropylidene diphthalic anhydride (6FDA) as monomers. High molecular weights were achieved by both methods, and the physical properties of the materials were investigated by spectroscopic and thermal analytical techniques. Polymers exhibited excellent thermal properties and film-forming ability, which allowed them to be tested as dense membranes for gas separation after a convenient treatment at high temperature (450 °C) to promote thermal rearrangement (TR). Spectroscopic evidences indicated that the final composition of the TR materials seemed not to correspond to TR-polibenzoxazoles, as it is the case when ortho-hydroxypolyimides are exposed to similar thermal treatments. A detailed study was carried out with the purpose of elucidating the actual mechanism of rearrangement, comparing ortho-

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Direct Ink Writing of High Performance Architectured Polyimides with Low Dimensional Shrinkage

Guo

Yan

et al. 2019

Adv Eng Mater

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Despite of the outstanding chemical‐resistance, thermal and thermomechanical properties, and dielectric performance of three dimensional (3D) printed polyimides, the high dimensional shrinkage (more than 45%) between the as‐printed and final imidized objects may become the biggest obstacle on its practical applications. In this work, the authors present a two‐state curing strategy for realizing 3D printing of high performance polyimides via UV‐assisted direct ink writing (DIW) of poly (amide acid) (PAA) followed by thermal imidization. More specifically, PAA precursors modified with hydroxyethyl methacrylate are printed and thermally imidized at an elevated temperature to form 3D objects, which demonstrate a dimensional shrinkage less than 6%. The outstanding performances regarding thermal resistance, solvent‐proofing, and mechanical strength are comprehensively characterized, and some attracting polyimide functional 3D devices, such as polyimide spring and enameled wire, are readily achieved. Their DIW strategy realizes three‐dimensional polyimide architectures with low volume shrinkage and provides a tremendous potential for 3D printing of polyimides in many fields including aerospace, automobile, microelectronics, and engineering.

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Study of the processing chemistry of polyimides with thermogravimetry/Fourier transform infrared/mass spectrometry techniques

Cited by 7 publications

References 2 publications

Synthesis and characterization of polyimide thin films obtained by thermal evaporation and solid state reaction

Synthesis and characterization of polyimide thin films obtained by thermal evaporation and solid state reaction

Gas separation membranes made through thermal rearrangement of ortho-methoxypolyimides

Direct Ink Writing of High Performance Architectured Polyimides with Low Dimensional Shrinkage

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