“…After then pulse plating has received much attention for it can yield smaller grain size and evener particles distribution than direct current (DC) methods. More and more pulse plating researches have been done on electrodepositions of Zn [4], Zn-Fe [3,5,6], Zn-Ni [7][8][9][10][11][12], Zn-Co [5,[13][14][15], ZnS [16], other ternary alloy coatings [17,18] and composite coatings [19]. Pulsed current (PC) and reverse pulsed current (RPC) are also the versatile methods for the preparation of nanostructured metals and alloys [20,21].…”