Features of thermal transport in multilayered porous silicon nanostructures are considered. Such nanostructures were fabricated by electrochemical etching of monocrystalline Si substrates by applying periodically changed current density.Hereby, the multilayered structures with specific phononic properties were formed. Photoacoustic (PA) technique in gas-microphone configuration was applied for thermal conductivity evaluation. Experimental amplitude-frequency dependencies were adjusted by temperature distribution simulation with thermal conductivity of the multilayered porous structure as a fitting parameter. The experimentally determined values of thermal conductivity were found to be significantly lower than theoretically calculated ones. Such difference was associated with the presence of thermal resistance at the interfaces between porous layers with different porosities arising because of elastic parameters mismatch (acoustical mismatch). Accordingly, the magnitude of this interfacial thermal resistance was experimentally evaluated for the first time.Furthermore, crucial impact of the resistance on thermal transport perturbation in a multilayered porous silicon structure was revealed.generations of integrated circuits (ICs), three-dimensional (3D) integration and ultrafast high-power density transistors has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. Understanding thermal transport at the nanoscale is therefore crucial for a fundamental description of energy flow in nanomaterials, as well as a critical issue toward achieving optimal performance and reliability of modern electronic, optoelectronic, photonic devices and systems. Thermal transport at the nanoscale is fundamentally different from that at the macroscale and is determined by the distribution of carrier mean free paths and energy dispersion in a material, the dimension of the structure and the distance over which heat is propagated. The opportunity to shape new nanostructures that efficiently scatter phonons, reducing the thermal conductivity, without altering the electrical properties of the material enables the potential implementation of proficient thermoelectric devices to work as coolers or power generators from waste heat [1][2][3][4]. Recently, there has been much interest in the thermal conductivity of semiconductor superlattices (SLs) due to their promising applications in a variety of devices.Since important surface-to-volume fraction in nanostructured materials, heat conduction across solid-solid interface predominates thermal transport there.Particularly, in SLs, multiple interfaces between different materials play a critical role in the thermal conductivity reduction [5,6]. Cutting-edge experimental techniques have enabled the measurements of the in-plane [7] and cross-plane [8] thermal conductivity