2010
DOI: 10.4071/2010dpc-wp13
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Study of Thermo-Mechanical Reliability of TSV for 8-Layer Stacked Multi Chip Package

Abstract: Through silicon via (TSV) technology is becoming a hot topic for three dimensional integration in IC packaging industry. However, TSV technology raises several reliability concerns particularly caused by thermally induced stress. In this study, the thermo-mechanical reliability of copper TSV technology for the multi chip packaging was investigated using finite element method. For the multi chip package design, the 8-layer stacked chip packaging with TSV structure has been constructed as our test vehicle. The n… Show more

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