Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Yao, Mingjun; Zhao, Ning; Wang, Teng; Xiao, Zhiyi; Ma, Haitao

doi:10.1007/s11664-018-6701-z

Cited by 10 publications

(3 citation statements)

References 14 publications

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“…The demand for high-performance computing based on artificial intelligence continues to break out in diverse applications. − Increasing the size of transistors is the traditional way to improve computing power; however, it is limited by the lithographic size and device miniaturization. The advanced three-dimensional interconnect package is a novel approach to enhance computational capability. , From the traditional liquid metal welding technique to the fan-out package, the I/O interconnect pitch has greatly shrunk to the smallest 36 μm. − Unfortunately, due to the solder volume and deformation problem, it is difficult to satisfy the advanced process for a smaller pitch.…”

Section: Introductionmentioning

confidence: 99%

The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding

Zhang,

Lian,

Ding

et al. 2024

ACS Appl. Electron. Mater.

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With the rapid development of artificial intelligence, high performance computing will break through Moore's law and move toward three-dimensional (3D) package integration of chips. Hybrid bonding has become a potential solution for advanced packaging, as the interconnect pitch shrinks to less than 1 μm. Die to wafer (D2W) hybrid bonding consists of chemical mechanical polishing (CMP), blading, plasma activation, prebonding, and annealing processes. The diced dies that are attached to tape will undergo several steps such as cleaning and activation; therefore, the tape should present a high adhesion and stability property. This paper innovatively studies the adhesion and stability of tapes in a variety of chemicals and theoretically reveals the influence of the composition and structure of the tape adhesive layer on performance. Two types of tapes (A and B) from different brands have been tested and their average peeling strength on the dies was measured; the results present that tape A remains stable no matter in the acidic or alkaline solution, even with megasonics applied for a long time. The adhesive layer of tape A is closely connected to the substrate layer, and the surface roughness of 1.1 nm is much smaller than that of tape B. Besides, the XPS analysis verifies that there are abundant carboxyl and ester groups on the surface of the tape A adhesive layer, which contributes to the outstanding adhesion of dies on the tape and stability performance in a variety of chemical environments. This research reveals the reasons for the adhesion and stability performance of the tape, which will provide a theoretical basis for the selection of die cleaning tape and support the development of the D2W hybrid bonding process and high-density packaging technology.

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Section: Introductionmentioning

confidence: 99%

The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding

Zhang,

Lian,

Ding

et al. 2024

ACS Appl. Electron. Mater.

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“…Typical hybrid bonding consists of metal/metal and adhesive/adhesive bonding; the former achieves electrical interconnection and the latter provides passivation protection and mechanical support. Most researchers have achieved the hybrid bonding process by two steps, where they separately bond metals and adhesives [ 5 , 6 , 7 , 8 ], as shown in Figure 1 a,b. The “adhesive first” method brings benefits of being void-free and having reliable adhesive bonding but raises serious misalignment of the metal interconnection due to the fluidity and volume shrinkage of adhesives during the curing process.…”

Section: Introductionmentioning

confidence: 99%

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

et al. 2022

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Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration, but they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed cured polyimides. The optimized process achieves a void-less bonding with a maximum shear strength of 35.3 MPa at a low temperature of 250 °C in merely 2 min, significantly shortening the bonding period and decreasing thermal stress. It is found that the plasma activation generates hydrophilic groups on the polyimide surface, and the wetting process further introduces more −OH groups and water molecules on the activated polyimide surface. The synergistic process of plasma activation and wetting facilitates the bridging of polyimide interfaces to achieve bonding, providing an alternative path for adhesive bonding in 3D integration.

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“…Typical hybrid bonding consists of metal/metal and adhesive/adhesive bonding; the former achieves electrical interconnection and the latter provides passivation protection and mechanical support. Most researchers achieve the hybrid bonding process by two steps, where they separately bond metals and adhesives [5][6][7][8], as shown in Figure 1 (a) and (b). The "adhesive first" method benefits void-free and reliable adhesive bonding but raises serious misalignment of metal interconnection due to the fluidity and volume shrinkage of adhesives during the curing process.…”

Section: Introductionmentioning

confidence: 99%

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Meng¹,

Gao²,

Wang³

et al. 2022

Preprint

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Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration while they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed cured polyimides. The optimized process achieves a void-less bonding with a maximum shear strength of 35.3 MPa at a low temperature of 250 °C in merely 2 min, significantly shortening the bonding period and decreasing thermal stress. It is found that the plasma activation generated hydrophilic groups on the polyimide surface, and the wetting process further introduced more -OH groups and water molecular on the activated polyimide surface. The synergistic process of plasma activation and wetting facilitate bridging polyimide interfaces to achieve bonding, providing an alternative path for adhesive bonding in 3D integration.

show abstract

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Cited by 10 publications

References 14 publications

The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding

The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

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