2004
DOI: 10.1007/s11664-004-0251-2
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Study of Ti/W/Cu, Ti/Co/Cu, and Ti/Mo/Cu multilayer structures as schottky metals for GaAs diodes

Abstract: Schottky structures with copper and refractory metals as diffusion barrier for GaAs Schottky diodes were evaluated. These structures have lower series resistances than the conventionally used Ti/Pt/Au structure. Based on the electrical and material characteristics, the Ti/W/Cu and Ti/Mo/Cu Schottky structures are thermally stable up to 400°C; the Ti/Co/Cu Schottky structure is thermally stable up to 300°C. Overall, the copper-metallized Schottky structures have excellent electrical characteristics and thermal … Show more

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Cited by 7 publications
(3 citation statements)
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“…With their high thermal stability, refractory metals, such as tungsten (W), tantalum (Ta), titanium (Ti), etc., are also widely utilized as the Cu barrier layer. 17,24 Particularly, due to its low electrical resistivity ($5.6 lXÁcm), the W thin film can also be used as an infrared reflector, 17 but it still has a higher thermal emittance than Cu. With the combination of highly thermal stable W and highly conductive Cu, it is possible to realize a high-performance infrared reflector with high thermal stability.…”
Section: Introductionmentioning
confidence: 99%
“…With their high thermal stability, refractory metals, such as tungsten (W), tantalum (Ta), titanium (Ti), etc., are also widely utilized as the Cu barrier layer. 17,24 Particularly, due to its low electrical resistivity ($5.6 lXÁcm), the W thin film can also be used as an infrared reflector, 17 but it still has a higher thermal emittance than Cu. With the combination of highly thermal stable W and highly conductive Cu, it is possible to realize a high-performance infrared reflector with high thermal stability.…”
Section: Introductionmentioning
confidence: 99%
“…This is largely due to the lack of knowledge on the subject. Most of the studies published to date are devoted to the development of technology for the production of separate elements of MMIC by using Cu metallization: ohmic and barrier contacts of transistors [7]- [10], interconnects [11], [12], or backside metallization [13]. Studies [14], [15] address the issues of creating GaAs transistors with fully copper metallization.…”
Section: Introductionmentioning
confidence: 99%
“…With their high thermal stability, refractory metals, such as tungsten (W), tantalum (Ta), and titanium (Ti), are also widely utilized as Cu barrier layer [201,216,217]. Particularly, with the low electrical resistivity (~5.6 μΩ•cm), W thin film is very suitable as an infrared reflector [201], but it still has a higher resistivity than Cu.…”
Section: Introductionmentioning
confidence: 99%