2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits 2012
DOI: 10.1109/ipfa.2012.6306258
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Study of underfill-to-soldermask delamination in flip-chip packages

Zi-Ying Oh1,
Robert C. Newman
2
,
M.C. Ong3
et al.
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