Study on chatter suppression in ultrasonic-assisted grinding of thin-walled workpiece of SiCp/Al composites

Abstract

To suppress chatter is very important for ensuring processing quality and efficiency in ultrasonic-assisted grinding of thin-walled workpiece of SiCp/Al composites. Based on the chatter mechanism analysis, a stability analysis model is built and the analytical method is proposed. The cutting parameters can be selected reasonably based on the lobe diagram of stability, and the experiments were conducted using the parameters of selected points on lobe diagram. The experimental results show that the cutting force and surface roughness of unstable points are much larger than that of stable points, the vibration marks appear on the workpiece surface with unstable machining, and the surface quality is better in stable machining, which indicate that the chatter could be suppressed by this method to guarantee machining quality and efficiency.

Nickel-plated SiCp/Al composites brazed in the air: microstructure and mechanical properties of brazed joints under different processes

“…Aluminum matrix composites reinforced with SiC particles (SiC p /Al MMCs) have attracted more and more researchers' attention because of their low preparation cost and simple preparation method [4][5][6][7] . SiC p /Al MMCs have excellent properties such as high speci c strength, speci c modulus and speci c stiffness, and low coe cient of thermal expansion [8][9][10][11] . SiC p /Al MMCs consisted of SiC particle ceramic phase and aluminum matrix [12,13] .…”

Experimental Studies of the Machinability of SiCp/Al with Different Volume Fractions under Ultrasonic-Assisted Grinding

“…These defects will reduce the expected life of the product or cause it to scrape because of their negative impact on fatigue behavior. This hinders the wide application of SiCp/Al composites; hence, some scholars have investigated the machining of SiCp/Al composites using novel machining [ 7 , 8 , 9 ]. In recent years, UAG machining has developed rapidly, and it has good prospects for application.…”