Study on diamond dressing for non-uniformity of pad surface topography in CMP process

Chen, Chao‐Chang A.; Pham, Quoc-Phong

doi:10.1007/s00170-017-0060-4

Cited by 15 publications

(7 citation statements)

References 18 publications

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“…The main purpose of the system is to obtain the total surface information of polishing pads. Because the system is set up on the polishing machine with a rotating platen, the sensor's scanning locus is combined with platen rotating and swing motion of the dressing arm [17]. The scanning locus of height sensor needs to be calculated with the actual position of the sensor, as the thickness of the pad changes with the radius during the CMP process.…”

Section: Mathematical Model Of Scanning Locusmentioning

confidence: 99%

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Chen

Liao

et al. 2020

Applied Sciences

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This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure the substrate wafer or thin film on wafer that has reached the required planarization after deposition for lithographic processing of the desired structures of devices. Surface properties of polishing pad have a huge influence on the material removal rate (MRR) and quality of wafer surface by CMP process. A DPMS has been developed to analyze the performance level of polishing pad for CMP. A chromatic confocal sensor is attached on a designed fixture arm to acquire pad topography data. By swing-arm motion with continuous data acquisition, the surface topography information of pad can be gathered dynamically. Measuring data are analyzed with a designed FFT filter to remove mechanical vibration and disturbance. Then the pad surface profile and groove depth can be calculated, which the pad’s index PU (pad uniformity) and PELI (pad effective lifetime index) are developed to evaluate the pad’s performance level. Finally, 50 rounds of CMP experiments have been executed to investigate the correlations of MRR and surface roughness of as-CMP wafer with pad performance. Results of this study can be used to monitor the pad dressing process and CMP parameter evaluation for production of IC devices.

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Section: Mathematical Model Of Scanning Locusmentioning

confidence: 99%

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Chen

Liao

et al. 2020

Applied Sciences

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“…25 The motion model of the abrasive particles was also used to predict the pad profile after dressing. 26,27 The effects of the slurry, pad and kinematic variables on the single-side planarization (SSP) process were thoroughly studied. However, the optimization methods for SSP are not suitable in double-sided planarization (DSP), especially in the mass production of DSP.…”

Section: Introductionmentioning

confidence: 99%

Profile control processes based on contact types in silicon wafer DSP manufacturing management

Zhu

Zhang³

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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To reduce the manufacturing cost of integrated circuits, the size of the silicon wafer has become larger, with the diameter increasing from 200 to 450 mm. The large diameter silicon wafer poses challenges to the manufacturing process, as its surface profile is more difficult to control and the planarization process is harder to optimize in mass production. Based on different types of contact, gap adjustment and convex pad dressing methods were proposed in this paper to control the pressure distribution on the wafer, which further influenced the wafer profile. Pressure distributions with different gap values and different pad profiles were explained with contact mechanics and verified by simulations. The simulation results show that a negative gap value and a convex pad profile contribute to the improvement of the pressure uniformity on the wafer. Both methods were then applied in the double-sided planarization (DSP) process of 300 mm silicon wafers. The results from the test run of the DSP process show that wafer flatness is improved with a negative gap value. This indicates that gap adjustment is an effective approach for wafer profile control. In the subsequent mass production of the DSP process, silicon wafers with a global flatness of 120 nm and a site flatness of 21.7 nm were obtained.

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“…Chen and Pham 14 conducted a dressing study of a CMP polishing pad. A trajectory model of the grain motion was established based on the motion relationship of the dressing system.…”

Section: Introductionmentioning

confidence: 99%

Study on optimization of process parameters in dressing of bonnet polishing tool

Pan

Xie

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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The surface quality of the polishing tool is of great importance to the polishing performance, and it is usually maintained by a dressing process. The dressing parameters, which ultimately influence the effectiveness of dressing, are difficult to determine because the dressing process involves complex multiaxis motion control. To improve the machining efficiency and quality of the polishing tool, this study investigated the optimization of the process parameters. First, the grain on the grinding wheel was regarded as the research object. The trajectory model of the grain was established using multi-body theory. Subsequently, based on the above model, an optimization method was developed to optimize the process parameters. The experimental results showed that the average initial contour error of the surface of the polishing tools was 267.46 µm. When polishing tools were dressed using the worst process parameters, the surface quality was improved by an average of 67.82% to 86.06 µm. When polishing tools were dressed using the best process parameters, the surface quality of the polishing tools improved by 86.57% to 35.92 µm on average. This paper demonstrated the accuracy of the model and effectiveness of the proposed optimization method.

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Study on diamond dressing for non-uniformity of pad surface topography in CMP process

Cited by 15 publications

References 18 publications

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Profile control processes based on contact types in silicon wafer DSP manufacturing management

Study on optimization of process parameters in dressing of bonnet polishing tool

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