Study on Interface Structure of Cu/Al Clad Plates by Roll Casting

Chang, Qinghua; Xie, Jingpei; Mao, A. Y.; Wang, Wenyan

doi:10.3390/met8100770

Cited by 17 publications

(5 citation statements)

References 20 publications

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“…Four major techniques are commonly used that can be further subdivided. The first class incorporates cladding methods like roll cladding, [29][30][31][32][33][34] thermo-compression bonding, 12,26,35 and friction welding. [36][37][38] The second class includes vapor deposition techniques like physical (PVD) and chemical vapor deposition (CVD).…”

mentioning

confidence: 99%

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

Gerngross,

Baytekin-Gerngross,

Carstensen

et al. 2024

J. Electrochem. Soc.

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The electrochemical formation of high-mechanical-load-bearing Al-Cu joints and their characterization is presented. These Al-Cu joints rely on a mechanical interlocking between the Al and Cu layer ob-tained by nanoscale sculpturing of the Al joint partner, resulting in a hierarchical surface structure. The structure consists of cubes of var-ious sizes acting like hooks. When enclosed by Cu the cubic Al hooks establish a rigid connection between the Al and Cu joint part-ners. In addition, the hierarchical cubic Al structures allow for a gradual transition from Al to Cu in the Al-Cu joint. Therefore, such Al-Cu joints exhibit an extraordinary load carrying ability compared to other Al-Cu joints.

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confidence: 99%

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

Gerngross,

Baytekin-Gerngross,

Carstensen

et al. 2024

J. Electrochem. Soc.

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“…기존 방열 모듈 접합은 450 o C 이상의 고온에서 용가재만 녹여 접합하는 브레이징 (Brazing) 공정을 통해 진행하였다 [9]. 최근에는 450 o C 이 하의 저온에서 클래딩(Cladding)과 솔더링(Soldering) 공정 을 통해 Cu와 Al을 직접 접합하여 Cu와 Al의 장점을 모 두 갖는 Cu/솔더/Al 구조의 방열 모듈이 각광받고 있다 [13][14][15][16]. Cu, Al의 솔더링 공정에 사용되는 솔더의 경우 좋은 젖음성과 접합부신뢰성을 가진 3원계의 Sn-3.0Ag-0.5Cu(SAC305) 솔더 또는 2원계의 Sn-Cu계, Sn-Ag계 솔 더가 주로 사용된다 [17][18][19][20][21]…”

Section: 대한금속 • 재료학회지 제62권 제4호 (2024년 4월)unclassified

Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application

Jeong,

Kim,

Kim

et al. 2024

Korean J. Met. Mater.

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The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu6Sn5 intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag3Al IMC was formed at the lower SAC305/Al interface, and a black layer of Al2Cu IMC was formed at a distance of about 20 µm from the Al interface. The Al atoms from the Al pad diffused towards the SAC305 solder during the bonding process and reacted with Cu to form the Al2Cu IMC. After post-annealing for 500 h at 150°C, the growth of Cu-Sn and Al2Cu IMCs followed a linear relationship with the square root of the annealing time, which could be understood by a diffusion-dominant mechanism. To measure the bonding strength, the lap shear test was evaluated on the Cu/SAC305/Al structure with time during post-annealing at 150°C. Initial bonding strength of around 118.80 MPa decreased to 92.4MPa after post-annealing for 200h, and then remained constant until 500 h. And the fracture locus was the mixed mode of SAC305/Al2Cu interface and cohesive inside SAC305 solder. Also, when the post-annealing time was increased from 150 h to 200 h, the fracture toughness decreased sharply from 438 J/m3 to 100 J/m3. This decrease seems to be closely related to an increase in the SAC305/Al2Cu interface fracture mode. This is believed to be due to the increase in the SAC305/Al2Cu interface fracture mode due to the growth of the Al2Cu layer thickness.

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“…The time step in the simulation was set to 1 fs, the X and Y-axis directions of the simulation box were periodic boundary conditions, while the Z-axis direction was the mirror boundary condition. The Langevin algorithm was employed to control the temperature of the system, whereas the velocity Verlet algorithm was used to solve the equations of motion for particles [44,46].…”

Section: Materials and Preparation Processmentioning

confidence: 99%

Molecular Simulations of Sputtering Preparation and Transformation of Surface Properties of Au/Cu Alloy Coatings Under Different Incident Energies

Zhang

Tian

Peng

2019

Metals

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The surface properties of coatings during deposition are strongly influenced by temperature, particle fluxes, and compositions. In addition, the precursor incident energy also affects the surface properties of coatings during sputtering. The atomistic processes associated with the microstructure of coatings and the surface morphological evolution during sputtering are difficult to observe. Thus, in the present study, molecular dynamics simulation was employed to investigate the surface properties of Au/Cu alloy coatings (Cu substrate sputtering by Au atoms) with different incident energies (0.15 eV, 0.3 eV, 0.6 eV). Subsequently, the sputtering depth of the Au atoms, the particle distribution of the Au/Cu alloy coating system, the radial distribution function of particles in the coatings, the mean square displacement of the Cu atoms in the substrate, and the roughness of the coatings were analyzed. Results showed that the crystal structure and the sputtering depth of Au atoms were hardly influenced by the incident energy, and the incident energy had little impact on the motion of deep-lying atoms in the substrate. However, higher incident energy resulted in higher surface temperature of coatings, and more Au atoms existed in the coherent interface. Moreover, it strengthened the motion of Cu atoms and reduced the surface roughness. Therefore, the crystal structure of coatings and the motions of deep-lying atoms in the substrate are not influenced by the incident energy. However, the increase in incident energy will enhance the combination of coatings and the base while optimizing the surface structure.

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Study on Interface Structure of Cu/Al Clad Plates by Roll Casting

Cited by 17 publications

References 20 publications

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application

Molecular Simulations of Sputtering Preparation and Transformation of Surface Properties of Au/Cu Alloy Coatings Under Different Incident Energies

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