Study on low temperature brazing of magnesium alloy to aluminum alloy using Sn–xZn solders

Wen, Zhi; Wang, Hongyang; Li, Liming

doi:10.1016/j.matdes.2012.02.021

Cited by 45 publications

(22 citation statements)

References 24 publications

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“…Furnace brazing is used to join dissimilar materials such as aluminium to stainless steel, and high quality joints can be achieved at 600 8C by using an eutectic filler (Al-Si alloy) [202]. In electronic, aerospace and automotive sectors there is a need to join magnesium alloys with metals such as titanium and aluminium [226,274]. A brazing process at temperatures of 500 8C using Sn-30Zn solders is beneficial for joining Mg and Al [274].…”

Section: Brazing and Solderingmentioning

confidence: 99%

Joining of dissimilar materials

2015

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Section: Brazing and Solderingmentioning

confidence: 99%

Joining of dissimilar materials

2015

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“…Sn also has a relatively low melting point and can interact with both Mg and Al, so Sn and Sn-Zn interlayers have been used to weld Mg and Al [ 47 , 48 ]. The addition of Sn and Sn-Zn interlayers were both observed to successfully eliminate the brittle Mg 17 Al 12 and Mg 2 Al 3 IMCs, which were replaced by the new formed composite layer, resulting in a significant improvement in joint strength.…”

Section: Solid State Processesmentioning

confidence: 99%

“…The addition of Sn and Sn-Zn interlayers were both observed to successfully eliminate the brittle Mg 17 Al 12 and Mg 2 Al 3 IMCs, which were replaced by the new formed composite layer, resulting in a significant improvement in joint strength. However, Sn and Mg 2 Sn were located on both the Al and Mg sides of the matching fracture surfaces indicating that the tensile shear failure occurred through the interior of the interlayer [ 47 ]. The formation of Mg-Sn IMCs in the center of the bonding zone becomes the key to the strength.…”

Section: Solid State Processesmentioning

confidence: 99%

“…The maximum average strength achieved was 120.1 MPa using Zn-30Al filler metal [ 58 , 59 ]. Fine grain strengthening is a common method to increase the property of materials, and rare-earth and Ti are great elements for Mg alloys and Al alloys [ 43 , 46 , 47 , 60 ]. There, Liu et al [ 61 , 62 ] investigated the effects of Ce and Ti on the microstructures and strength, and the results showed that Ti can effectively increase the Mg/Al joint strength to 148 MPa with a Zn-29.5Al-0.5Ti filler metal.…”

Section: Fusion Weldingmentioning

confidence: 99%

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A Review of Dissimilar Welding Techniques for Magnesium Alloys to Aluminum Alloys

2014

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Welding of dissimilar magnesium alloys and aluminum alloys is an important issue because of their increasing applications in industries. In this document, the research and progress of a variety of welding techniques for joining dissimilar Mg alloys and Al alloys are reviewed from different perspectives. Welding of dissimilar Mg and Al is challenging due to the formation of brittle intermetallic compound (IMC) such as Mg17Al12 and Mg2Al3. In order to increase the joint strength, three main research approaches were used to eliminate or reduce the Mg-Al intermetallic reaction layer. First, solid state welding techniques which have a low welding temperature were used to reduce the IMCs. Second, IMC variety and distribution were controlled to avoid the degradation of the joining strength in fusion welding. Third, techniques which have relatively controllable reaction time and energy were used to eliminate the IMCs. Some important processing parameters and their effects on weld quality are discussed, and the microstructure and metallurgical reaction are described. Mechanical properties of welds such as hardness, tensile, shear and fatigue strength are discussed. The aim of the report is to review the recent progress in the welding of dissimilar Mg and Al to provide a basis for follow-up research.

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“…But a two-step soldering process is needed by brushing the bonded solder pad formed in the first step soldering. Sn-xZn solders (M.P=198.5°C) have ever been reported to be able to bond the Al alloys [15][16][17]. The M.P of all these solders is too low to be used in high temperature electronics (>200°C).…”

Section: Introductionmentioning

confidence: 99%

Soldering of non-wettable Al electrode using Au-based solder

2013

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In manufacturing three-dimensional SiC power modules, the Al electrode of SiC power devices should be soldered to the substrate. However, the Al electrode is difficult to be bonded by a solder due to the naturally formed aluminum oxide on it. In this paper, we describe an effective approach for soldering the non-wettable Al electrode by fabricating a Au-stud bump in the Al electrode together with a Au-20 wt% Sn or Au-12 wt% Ge solder. The soldering initiated at the Au bump and spreaded on the Al electrode. The soldering featured as reactive wetting, realized by the reaction of liquid Au in the Au-base solder and the Al electrode. The activation energy of the Au-20 wt% Sn soldering the Al electrode was Q =159 kJ/mol. A continuous Au 4 Al layer formed at the Au-20 wt% Sn bond interface. The shear strength exceeded 60 MPa, ∼1 order magnitude higher than the required shear strength. For the bond with Au-12 wt% Ge solder on the Al electrode with a Au bump, the liquid Au-12 wt% Ge solder reacted with the solid Al electrode and formed a Au-Ge-Al solid solution after solidification. The shear strength of the Au-12 wt% Ge solder on the Al electrode with a Au bump was beyond 50 MPa. Little electrical characteristics of the SiC-SBD changed after the Al electrode was bonded to a circuit substrate using this technology.

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Study on low temperature brazing of magnesium alloy to aluminum alloy using Sn–xZn solders

Cited by 45 publications

References 24 publications

Joining of dissimilar materials

Joining of dissimilar materials

A Review of Dissimilar Welding Techniques for Magnesium Alloys to Aluminum Alloys

Soldering of non-wettable Al electrode using Au-based solder

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