Study on metal decorated oxidized multiwalled carbon nanotube (MWCNT) - epoxy adhesive for thermal conductivity applications

Singh, Amit Kumar; Panda, Bishnu P.; Mohanty, Smita; Nayak, Sanjay K.; Gupta, Manoj Kumar

doi:10.1007/s10854-017-6621-3

Cited by 28 publications

(11 citation statements)

References 43 publications

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“…The decrement in joining performance for water immersed specimens may be associated with plasticization caused by water absorption which weaken the interphase within the GNP and polymer matrix [ 26 , 39 , 40 , 41 ] resulting in deterioration of bonding strength. This effect might have been further pronounced by the aggregation of GNP content and the resultant stress concentration leading to crack initiation and propagation [ 35 , 42 ]. Nevertheless, it is also observed that there are few exceptions on specimens with 0.5 wt% GNP at 50~60 immersion period where slight increment in bonding performance is observed.…”

Section: Resultsmentioning

confidence: 99%

Moisture Absorption Behavior and Adhesion Properties of GNP/Epoxy Nanocomposite Adhesives

2021

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In the current work, an attempt has been made to investigate the effect of Graphene Nanoplatelets (GNP) reinforcement to water absorption behavior and mechanical properties of adhesive bonding with epoxy. Epoxy adhesive with various GNP content (i.e., 0.0~2.0 wt%) was utilized to joint aluminum adherend subjected to various immersion periods (i.e., 0~60 days). Subsequently, the effect of GNP reinforcement on water uptake, water absorption rate and tensile shear strength was investigated. Depending on GNP content, two distinct behaviors in water uptake and moisture absorption rate have been observed; specimens with lower GNP content (0.5~1.0 wt%) have demonstrated increased/retention of water uptake and water absorption rate regardless of immersion period. Meanwhile, at higher GNP content (1.5~2.0 wt%), decreased water uptake and water absorption rate are generally observed. At similar GNP content, regardless of immersion periods, water immersed specimens generally demonstrate higher or retention of shear strength when compared to specimens at 0-day immersion period. These observations suggest that the relation between moisture absorption behavior and mechanical properties of GNP-reinforced adhesive with GNP content are rather complex which might be attributed to the interplay of several possible mechanisms.

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Section: Resultsmentioning

confidence: 99%

Moisture Absorption Behavior and Adhesion Properties of GNP/Epoxy Nanocomposite Adhesives

2021

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“…Epoxy resins have been widely used in the fabrication and assembly of microelectronic devices, highly integrated memory chips and electronic packaging applications. [5,6] Epoxy resins often offer superior mechanical properties, lower shrinkage, good dimensional stability and high electrical resistivity. [7][8][9] However, low T c between 0.1 and 0.3 W/ mk, limit its potential applications as they cannot meet the requirement of fast heat conduction for advanced electronic products.…”

Section: Introductionmentioning

confidence: 99%

Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

Singh

Panda

Mohanty

et al. 2017

Polymers for Advanced Techs

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In the present study, the synergistic effect of hybrid boron nitride (BN) with graphene on the thermal conductivity of epoxy adhesives has been reported. Graphene was prepared by chemical reduction of graphite oxide (GO) in a mixture of concentrated H2SO4/H3PO4 acid. The particle size distribution of GO was found to be ~10 μm and a low contact angle of 54° with water indicated a hydrophilic surface. The structure of prepared graphene was characterized by Fourier transform infrared (FTIR), X‐ray diffraction (XRD), Raman spectroscopy and atomic force microscopy (AFM). The thermal conductivity of adhesives was measured using guarded hot plate technique. Test results indicated an improvement in the thermal conductivity up to 1.65 W/mK, which was about ninefold increase over pristine epoxy. Mechanical properties of different epoxy formulations were also measured employing lap shear test. The surface characterization of different epoxy adhesive systems was characterized through XRD, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies. Fourier transform infrared also served to determine the nature of interactions between filler particles and epoxy resin. Non‐isothermal differential scanning calorimetric (DSC) technique was used to investigate the effects of graphene and BN particles on the cure kinetics and cross‐linking reaction of epoxy cured with amine curing agent. The Kissinger equation, the model‐free isoconversional Flynn–Wall–Ozawa method and the Ozawa model were used to analyze the kinetic parameter. Copyright © 2017 John Wiley & Sons, Ltd.

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“…This decrement may be due to the accumulation of lower density, porous, and layered structured EG-C filler and stress concentration in agglomeration areas initiate crack propagation in EG-C–filled composite. 61 The micrometric gaps, at the vicinity of reinforcement turn as stress concentrators, caused the reduction in joining properties. Similar findings have been observed in Rajesh Kumar et al 16 and Amit Singh et al 61 On the other hand, EG-P–filled composite at 10 wt% showed 29.5% increased strength than EG-C–filled composite.…”

Section: Resultsmentioning

confidence: 99%

“…61 The micrometric gaps, at the vicinity of reinforcement turn as stress concentrators, caused the reduction in joining properties. Similar findings have been observed in Rajesh Kumar et al 16 and Amit Singh et al 61 On the other hand, EG-P–filled composite at 10 wt% showed 29.5% increased strength than EG-C–filled composite. This signified the synergistic contribution of ZnO particles and EG-P within the epoxy matrix that hinders the crack initiation, which enables an effective stress transfer between composite.…”

Section: Resultsmentioning

confidence: 99%

Two-different ways of synthesis for EG: Study of mechanical, thermal, and electrical properties of epoxy composite for TIMs

Nayak

Mishra

Pradhan

et al. 2020

High Performance Polymers

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The current study reports the synthesis of expanded graphite (EG) in two different ways and its fabrication with epoxy matrix to form composite at various filler fractions (5, 10, 12.5). One type EG (EG-C) is prepared by the electrochemical process using natural graphite flake (NGF), concentrated sulfuric acid, and ammonium persulfate, while the other (EG-P) is just mixing and heating of NGF with zinc nitrate hexahydrate. The functional groups of synthesized EG were confirmed by Fourier transform infrared spectroscopy. The surface morphology and microstructure of synthesized filler (EG-C, EG-P) were studied using X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. An optimum through-plane thermal conductivity (TC) of 2.04 and 2.22 W/mK was observed in the case of the composites containing 12.5 wt% of EG-C and EG-P, respectively. The obtained experimental TC was compared with three numerical thermal models, that is, inverse rule of mixture, Maxwell–Eucken model, and Agari model. Furthermore, the thermal stability of both composites was compared by using a thermogravimetric analyzer. The electrical resistivity of EG-P/epoxy composite at different formulations was higher than the EG-C-filled epoxy composites.

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Study on metal decorated oxidized multiwalled carbon nanotube (MWCNT) - epoxy adhesive for thermal conductivity applications

Cited by 28 publications

References 43 publications

Moisture Absorption Behavior and Adhesion Properties of GNP/Epoxy Nanocomposite Adhesives

Moisture Absorption Behavior and Adhesion Properties of GNP/Epoxy Nanocomposite Adhesives

Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

Two-different ways of synthesis for EG: Study of mechanical, thermal, and electrical properties of epoxy composite for TIMs

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