2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) 2020
DOI: 10.1109/eptc50525.2020.9315126
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Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation

Fa Xing
1
,
Yeow Chon Ong
2
,
Hong Wan Ng
3
et al.
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Cited by 8 publications
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