2017
DOI: 10.3788/lop54.071403
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Study on Performance Improvement of High Power Semiconductor Lasers

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“…The dry etching process was used to form a 100 μm wide strip, and SiO2 insulating film was applied on both sides to create a current injection area. Simultaneously, a weak refractive index guidance limitation was established in the lateral light field [18] . The metal electrode on the P surface consisted of Ti/Pt/Au, while the N surface had Ge/Ni/Au as its metal electrode.…”
Section: Device Design and Fabrication 21 Chip Preparationmentioning
confidence: 99%
“…The dry etching process was used to form a 100 μm wide strip, and SiO2 insulating film was applied on both sides to create a current injection area. Simultaneously, a weak refractive index guidance limitation was established in the lateral light field [18] . The metal electrode on the P surface consisted of Ti/Pt/Au, while the N surface had Ge/Ni/Au as its metal electrode.…”
Section: Device Design and Fabrication 21 Chip Preparationmentioning
confidence: 99%