Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell

Li, Hongshuang; Gao, Yufei; Ge, Peng; Zhang, Lei

doi:10.1007/s00170-019-04860-2

Cited by 21 publications

(4 citation statements)

References 21 publications

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“…The step of nickel pre-plating was performed in a solution containing 220 g/L nickel chloride hexahydrate (NiCl 2 ·6H 2 O; Aladdin, AR) and 100 mL/L hydrochloric acid (HCl; Chuandong, AR) at a current density of 5 A/dm 2 for 4 min. The nickel-plating step was performed in a solution containing 380 g/L nickel sulfamate (H 4 N 2 NiO 6 S 2 ·4H 2 O; Macklin, 99%), 32.5 g/L nickel chloride hexahydrate (NiCl 2 ·6H 2 O; Aladdin, AR), and 32.5 g/L boric acid (H 3 BO 3 ; Sinopharm, AR) [ 21 ] at a current density of 1 A/dm 2 for 1, 5, 10, 15, and 20 min, respectively. The water used in the experiments was up to the standard of I level.…”

Section: Methodsmentioning

confidence: 99%

The Controlled Compound Layer of Ni-Coated Nitrided Pure Iron

Shen

Zhang

et al. 2020

Nanomaterials

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In order not to sacrifice nitrided layer thickness and reduce brittle compound layer thickness, Ni-coated pretreatment was carried out with electrodeposition on a pure iron surface, followed by gas nitriding. The brittle compound layer thickness of duplex surface treated samples was reduced, and the nitrided layer thickness increased to 320 μm. The microhardness was 4 times harder, and the wear loss was reduced by 68% compared with the original material. The results indicate that Ni-coated pretreatment could effectively improve microhardness and wear resistance and realize the controlled microstructure of a brittle compound layer of pure iron without compromising nitrided layer thickness. Ni coating plays an important role in ammonia adsorption and decomposition, and in the transfer of active nitrogen atoms during nitriding.

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Section: Methodsmentioning

confidence: 99%

The Controlled Compound Layer of Ni-Coated Nitrided Pure Iron

Shen

Zhang

et al. 2020

Nanomaterials

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“…Renowned for its high degree of hardness, brittleness, and excellent chemical stability at room temperature, silicon is a crucial semiconductor material. The techniques of processing silicon include acid etching and wire cutting [ 12 , 13 ]. Acid etching is the chemical etching of silicon materials [ 14 ], such as using HNO 3 -HF for isotropic etching [ 15 ], employing KOH or NaOH for anisotropic etching [ 16 ], and utilizing plasma-etching techniques.…”

Section: Introductionmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

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Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

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“…With the rapid development of the photovoltaic and semiconductor industries, the existing sawing efficiency does not meet the production needs of enterprises; to improve the sawing speed and efficiency of the material, it is necessary to improve its alignment speed, so that it will be able to withstand high speeds [4,5]. Increasing the alignment speed can reduce the sawing time, material consumption, production costs, etc., but with the increasing speed of the alignment the operational stability requirements are also increasingly high [6,7].…”

Section: Introductionmentioning

confidence: 99%

Research on High-Speed Vibration and Structure Optimization of Multiwire Sawing Machine

Dong,

Liang,

Chang

et al. 2023

Applied Sciences

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To improve the sawing stability and slicing quality of an existing multi-wire saw under severe vibrations using a high wire speed, its structure is optimized to improve its structural stiffness, so that it can still maintain good operation stability under higher wire speed. First, a finite element simulation model is established based on the shape, structural and material characteristics of the multi-wire saw, and then a transient dynamic simulation calculation is carried out using finite element software to obtain the vibration characteristics of the machine, which is verified with the measured data. The results show that the error between the calculated and the measured value is less than 11.46%, which verifies the accuracy of the simulation. On this basis, a multi-objective optimization design method based on the response surface is used to optimize the structure of the whole machine, and the optimized model is simulated again to evaluate its optimization effect. The results show that the amplitude of the optimized machine at a 2400 m/min wire speed is equivalent to that of the original machine at a 1500 m/min wire speed, and the wire speed is increased by 60% year-on-year with the same operation stability, which can guide research on high-speed multi-wire saws and machine tool vibration control strategies.

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Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell

Cited by 21 publications

References 21 publications

The Controlled Compound Layer of Ni-Coated Nitrided Pure Iron

The Controlled Compound Layer of Ni-Coated Nitrided Pure Iron

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Research on High-Speed Vibration and Structure Optimization of Multiwire Sawing Machine

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