2022
DOI: 10.1007/s40430-022-03782-7
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Study on removal mechanism and surface quality of grinding carbon fiber toughened ceramic matrix composite

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Cited by 11 publications
(3 citation statements)
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“…The abrasive wheels used are constructed of green silicon carbide with a ceramic bond. The grinding wheel material used is characterized by the content of abrasive grains (rhombohedral) with very sharp edges, which are harder than the grains of electro-corundum [ 41 , 42 ].…”
Section: Methodsmentioning
confidence: 99%
“…The abrasive wheels used are constructed of green silicon carbide with a ceramic bond. The grinding wheel material used is characterized by the content of abrasive grains (rhombohedral) with very sharp edges, which are harder than the grains of electro-corundum [ 41 , 42 ].…”
Section: Methodsmentioning
confidence: 99%
“…The microcracks initiation and propagation were analyzed and it was found that the radial crack was deflected due to the existence of carbon fibers. Zhou et al [ 66 ] explored the grinding removal mechanism of 2.5D C f /SiC composites in different grinding directions based on experiments and SPH simulations, and found that the main removal mechanism is brittle fracture. The main damage modes are matrix cracking, interface debonding, fibers fracture, and fibers pulling out.…”
Section: Simulation Study Of Cmc Abrasive Machiningmentioning
confidence: 99%
“…When the diamond touches the material surface, plastic deformation occurs due to stress. With the increase in the diamond's entry depth, the stress on the surface gradually increases, and the surface begins to feature brittle fractures and internal, transverse, and longitudinal radial cracks [44,45]. The SiCf/SiC composite comprises a SiC matrix phase and SiC fiber phase.…”
Section: Ultrasonic Scratch Morphology Observation and Removal Mechan...mentioning
confidence: 99%