Study on single-phase and two-phase flow and heat transfer characteristics of HFE-7100 in manifold microchannel heat sink with corrugated bottom

Abstract

To solve the problem of high heat flux heat dissipation in microelectronic devices, a manifold microchannel heat sink with corrugated bottom (CB-MMC) is proposed on the basis of the manifold microchannel heat sink (MMC). The flow and heat transfer characteristics of HFE-7100 in MMC and CB-MMC are investigated numerically. The results show that CB-MMC reduces the pressure loss and enhances the heat transfer performance in single-phase flow. The orthogonal test method is used to obtain structural design solutions with optimal thermal performance. It is observed that the temperature reduction is always at the expense of the increase of the pressure drop. In addition, the optimization parameters combination obtained through comprehensive evaluation of temperature and pressure drop through weight matrix - optimized solution 19 (wavelength A = 800 ?m, amplitude B = 40 ?m, channel depth C = 180 ?m, outlet width D = 300 ?m, channel width E = 25 ?m). Its Tave has decreased by 6.89?C, ?P decreased by 10.27 kPa. Moreover, the subcooled boiling flow and heat transfer performance in MMC and CB-MMC are comparatively studied. The results demonstrate that the dynamic behavior of vapor bubbles causes large pressure fluctuations, which further leads to small temperature fluctuations, and thus reduces the stability of the flow and boiling heat transfer. Compared with MMC, CB-MMC exhibits more stable two-phase flow and better boiling heat transfer.